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PDF IP4791CZ12 Data sheet ( Hoja de datos )

Número de pieza IP4791CZ12
Descripción HDMI ESD protection - level shifter and back drive protection
Fabricantes NXP Semiconductors 
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IP4791CZ12
HDMI ESD protection, level shifter and backdrive protection
Rev. 3 — 7 January 2011
Product data sheet
1. General description
The IP4791CZ12 is designed to protect mobile High-Definition Multimedia
Interface (HDMI) transmitter interfaces. It includes level shifting for the Data Display
Channel (DDC), Consumer Electronic Control (CEC), hot plug signal and backdrive
protection. In addition, all signals are protected by high-level ElectroStatic
Discharge (ESD) protection diodes.
The level shifting function is required to protect the I/Os against overvoltages when the
transmitter operates at a supply voltage lower than the external devices. The IP4791CZ12
contains active buffers to provide the level shifting function, hot plug detect input and the
CEC pull-up current source.
The ESD protection diodes provide protection from ESD voltages up to ±8 kV, according
to IEC 61000-4-2, level 4.
2. Features and benefits
„ HDMI 1.3 compliant
„ Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
„ Robust ESD protection without degradation after multiple ESD strikes
„ Low leakage even after several hundred ESD discharges
„ Bidirectional level shifting buffer provided for DDC clock and data channels
„ Backdrive protection
„ Power management
„ CEC pull-up current source and level shifting buffer
„ Hot plug detect module with pull-down resistor
„ Matched 0.4 mm trace spacing for HDMI type C connector
3. Applications
The IP4791CZ12 can be used with a range of HDMI transmitter devices including:
„ Personal computer
„ Notebook
„ Mobile phone
„ DV camcorder
„ Digital still camera
„ MP3 player

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IP4791CZ12 pdf
NXP Semiconductors
IP4791CZ12
HDMI ESD protection, level shifter and backdrive protection
Table 5. Static characteristics …continued
VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
DDC buffer - connector side (pin 10 and pin 11) [3]
VIH HIGH-level input voltage
0.5 × VCC(5V0) -
VIL LOW-level input voltage
0.5 -
VIK input clamping voltage II = 18 mA
- 1.0
VOL
LOW-level output voltage internal pull-down current
-
100
VOH HIGH-level output voltage
[4] VCC(5V0) 0.02 -
CIO input/output capacitance VCC(5V0) = 0 V;
[4] -
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
8
Rpu pull-up resistance
DDC buffer - system side (pin 2 and pin 3) [3]
1.6 1.8
VIH HIGH-level input voltage
0.26 × VCC(1V8) -
VIL LOW-level input voltage
--
VIK input clamping voltage II = 18 mA
- 1.0
VOL LOW-level output voltage
--
VOH HIGH-level output voltage
[4] VCC(1V8) 0.02 -
CIO input/output capacitance VCC(5V0) = 0 V;
[4] -
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
6
Rpu pull-up resistance
CEC_OUT [3]
3.2 3.65
VIH HIGH-level input voltage
2.0
VIL LOW-level input voltage
-
VOH HIGH-level output voltage
2.88
VOL LOW-level output voltage IOL = 1.5 mA
-
CIO input/output capacitance VCC(5V0) = 0 V;
[4] -
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
-
-
3.3
100
8
Rpu pull-up resistance
23.4 26.0
Max Unit
5.5 V
0.3 × VCC(5V0) V
-V
200 mV
VCC(5V0) + 0.02 V
10 pF
2.0 kΩ
-V
0.20 × VCC(1V8) V
-V
0.28 × VCC(1V8) V
VCC(1V8) + 0.02 V
8 pF
4.1 kΩ
-V
0.80 V
3.63 V
200 mV
10 pF
28.6 kΩ
IP4791CZ12
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
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IP4791CZ12 arduino
NXP Semiconductors
IP4791CZ12
HDMI ESD protection, level shifter and backdrive protection
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
IP4791CZ12
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
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