|
|
PDF EMIF03-SIM04F3 Data sheet ( Hoja de datos )
| Número de pieza | EMIF03-SIM04F3 | |
| Descripción | EMI filter including ESD protection | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de EMIF03-SIM04F3 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
|
No Preview Available !
www.DataSheet4U.com
EMIF03-SIM04F3
3-line IPAD™, EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI/ESD protection
■ Lead-free package
■ Very thin package
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4
– ± 15 kV (air discharge)
– ± 8 kV (contact discharge)
■ IEC 61000-4-2 level 1
– ± 2 kV (air discharge)
– ± 2 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
Description
The EMIF03-SIM04F3 Flip Chip is a low
capacitance EMI filter designed to suppress
EMI/RFI noise in all systems subjected to
electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
subjected to ESD surges up to 15 kV.
Lead-free Flip-Chip package
(11 bumps)
Figure 1. Pin configuration (bump side)
123
A
B
C
D
Figure 2. Configuration
100 Ω
A1
R1
47 Ω
B1
R2
100 Ω
C1
R3
D1 D2 D3
A3
B3
C3
A2
GND
C2
GND
A2 and C2 bumps must be connected together on the PCB
May 2010
TM: IPAD is a trademark of STMicroelectronics.
Doc ID 17053 Rev 1
1/7
www.st.com
7
1 page  
EMIF03-SIM04F3
3 Package information
www.DataSheet4U.com
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 10. Package dimensions
255 µm ± 40
400 µm ± 30
605 µm ± 55
170 µm
Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
1.54 mm ± 30 µm
Figure 12. Marking
Dot, ST logo
ECOPACK® Grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
Figure 13. Flip-Chip tape and reel specification
Dot identifying pin A1 location 2.0 ± 0.05
4.0 ± 0.1
Ø 1.5 ± 0.1
0.69 ± 0.05
All dimensions in mm
1.31
4.0 ± 0.1
User direction of unreeling
Doc ID 17053 Rev 1
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF03-SIM04F3.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| EMIF03-SIM04F3 | EMI filter including ESD protection | ST Microelectronics |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |