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PDF IP4366CX8 Data sheet ( Hoja de datos )

Número de pieza IP4366CX8
Descripción (IP4064CX8 - IP4366CX8) Integrated SIM card passive filter array
Fabricantes NXP Semiconductors 
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IP4064CX8; IP4364CX8; www.DataSheet4U.com
IP4366CX8
Integrated SIM card passive filter array with ESD protection to
IEC 61000-4-2 level 4
Rev. 02 — 11 February 2010
Product data sheet
1. Product profile
1.1 General description
The IP4064CX8, IP4364CX8 and IP4366CX8 are 3-channel RC low-pass filter arrays
which are designed to provide filtering of undesired RF signals in the 800 MHz to
3000 MHz frequency band. In addition, the IP4064CX8, IP4364CX8 and IP4366CX8
incorporate diodes to provide protection to downstream components from ElectroStatic
Discharge (ESD) voltages as high as ±15 kV contact discharge according the
IEC 61000-4-2 model, far exceeding standard level 4.
All three devices are fabricated using monolithic silicon technology and integrate
three resistors and seven high-level ESD-protection diodes in a single Wafer-Level
Chip-Scale Package (WLCSP). These features make the IP4064CX8, IP4364CX8 and
IP4366CX8 ideal for use in applications requiring the utmost in miniaturization such as
mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features and benefits
„ Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
„ 3-channel SIM card interface integrated RC filter array
„ Integrated 100 Ω/100 Ω/47 Ω series channel resistors
„ Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding
IEC 61000-4-2 level 4
„ WLCSP with 0.4 mm pitch (IP4364CX8 and IP4366CX8) and 0.5 mm pitch
(IP4064CX8)
1.3 Applications
„ SIM interfaces in e.g. cellular and Personal Communication System (PCS) mobile
handsets

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IP4366CX8 pdf
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
www.DataSheet4U.com
Integrated SIM card passive filter array with ESD protection
7.2 Insertion loss
The IP4064CX8, IP4364CX8 and IP4366CX8 are mainly designed as an EMI/RFI filter for
SIM card interfaces. The insertion loss measurement configuration of a typical 50 Ω
NetWork Analyzer (NWA) system for evaluation of the IP4064CX8, IP4364CX8 and
IP4366CX8 is shown in Figure 4.
The insertion loss in a 50 Ω NWA system for all three channels of IP4064CX8 and
IP4364CX8 is depicted in Figure 5a while insertion loss of IP4366CX8 is shown in
Figure 5b. The insertion loss is measured with a test Printed-Circuit Board (PCB) utilizing
laser drilled micro-via holes that connect the PCB ground plane to the ground pins.
IN
50 Ω
DUT
TEST BOARD
OUT
50 Ω
Vgen
Fig 4. Frequency response measurement configuration
001aai755
0
s21
(dB)
10
001aag219
(1)
0
s21
(dB)
10
008aaa207
(1)
20 20
(2)
(2)
30 (3) 30
(3)
40
101
1
10 102 103 104
f (MHz)
(1) Channel B1 to B3.
(2) Channel A2 to A3.
(3) Channel C1 to C3.
a. IP4064CX8 and IP4364CX8
Fig 5. Measured insertion loss magnitudes
40
101
1
10 102 103 104
f (MHz)
b. IP4366CX8
IP4064CX8_IP4364CX8_IP4366CX8_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 11 February 2010
© NXP B.V. 2010. All rights reserved.
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IP4366CX8 arduino
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
www.DataSheet4U.com
Integrated SIM card passive filter array with ESD protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
9.3.4 Cleaning
Cleaning can be done after reflow soldering.
10. Abbreviations
Table 7. Abbreviations
Acronym
DUT
EMI
ESD
NWA
PCB
PCS
RFI
RoHS
SIM
WLCSP
Description
Device Under Test
ElectroMagnetic Interference
ElectroStatic Discharge
NetWork Analyzer
Printed-Circuit Board
Personal Communication System
Radio Frequency Interference
Restriction of Hazardous Substances
Subscriber Identity Module
Wafer-Level Chip-Scale Package
11. Revision history
Table 8. Revision history
Document ID
Release date Data sheet status Change notice Supersedes
IP4064CX8_IP4364CX8_
IP4366CX8_2
Modifications:
20100211
Product data sheet -
Type number IP4366CX8 added
Figure 3: added
General editorial update
IP4064CX8LF_IP4364CX8LF_1
IP4064CX8LF_IP4364CX8LF_1 20071112
Product data sheet -
-
IP4064CX8_IP4364CX8_IP4366CX8_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 11 February 2010
© NXP B.V. 2010. All rights reserved.
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