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PDF IP4352CX24 Data sheet ( Hoja de datos )

Número de pieza IP4352CX24
Descripción 9-channel SD memory card interface filter
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! IP4352CX24 Hoja de datos, Descripción, Manual

IP4352CX24
www.DataSheet4U.com
9-channel SD memory card interface filter with ESD protection
to IEC 61000-4-2 level 4
Rev. 02 — 3 May 2010
Product data sheet
1. Product profile
1.1 General description
The IP4352CX24 is a diode array designed to provide protection to downstream
components against ElectroStatic Discharge (ESD) voltages as high as 15 kV.
The IP4352CX24 integrates 9 pairs of rail-to-rail diodes, 15 resistors and 12 Zener diodes
in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon
semiconductor technology.
These features make the IP4352CX24 ideal for applications requiring miniaturized
components, such as mobile phone handsets, cordless telephones and personal digital
devices.
1.2 Features and benefits
„ Pb-free, RoHS compliant, free of halogen and antimony (Dark Green compliant)
„ All SD memory card channels have integrated ESD protection EMI and RF filters
„ ESD protection up to 15 kV at output terminals on 9 channels
„ Integrated EMI and RF filters with pull-up resistors on 5 channels
„ Integrated EMI and RF filters on 4 channels
„ SD card power supply protection
„ WLCSP with 0.4 mm pitch
„ Write protection with integrated card detect biasing resistor
„ Supports electrical card detection
„ Also available with different filter behavior and the same footprint as IP4350CX24
1.3 Applications
„ SD memory card interfaces in cellular and PCS mobile handsets
„ DECT handsets
„ Digital still and video cameras
„ Media players
„ Card readers

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IP4352CX24 pdf
NXP Semiconductors
IP4352CX24
www.DataSheet4U.com
9-channel SD memory card interface filter with ESD protection
Table 5. Frequency response
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
αil insertion loss all channels; Rgen = 50 Ω; RL = 50 Ω
f < 400 MHz
400 MHz < f < 800 MHz
800 MHz < f < 2.5 GHz
2.5 GHz < f < 6 GHz
Min Typ Max Unit
--9
9- -
13 - -
28 32 -
dB
dB
dB
dB
Table 6. Time domain response
Measured using source with 0 V to 3 V steps and 20 % to 70 % LOW-to-HIGH limits; Tamb = 25 °C;
unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
High speed Rgen = 50 Ω; tr = tf = 2 ns[1]
tr rise time
RL = 20 pF || 100 kΩ
RL = 40 pF || 100 kΩ
tf fall time
RL = 20 pF || 100 kΩ
RL = 40 pF || 100 kΩ
- 3.2 3.7 ns
- 4.4 6 ns
- 3.3 4.3 ns
- 5.5 7.5 ns
[1] Performed on all high speed lines (channels including R1 to R9, see Figure 2).
7. Application information
7.1 Insertion loss
The insertion loss was measured with a test PCB utilizing laser-drilled micro-via holes
which connect the PCB ground plane to the ground pins.
The configuration for measuring insertion loss in a 50 Ω system is shown in Figure 3.
IN
50 Ω
DUT
TEST BOARD
OUT
50 Ω
Vgen
001aai755
Fig 3. Frequency response measurement configuration
The frequency response curves measured on pins A1 and A4, E1 and E4 and C2 and C4
at frequencies up to 3 GHz are shown in Figure 4.
IP4352CX24_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 3 May 2010
© NXP B.V. 2010. All rights reserved.
5 of 13

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IP4352CX24 arduino
NXP Semiconductors
IP4352CX24
www.DataSheet4U.com
9-channel SD memory card interface filter with ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4352CX24_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 3 May 2010
© NXP B.V. 2010. All rights reserved.
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