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PDF BLF6G38-50 Data sheet ( Hoja de datos )
| Número de pieza | BLF6G38-50 | |
| Descripción | WiMAX power LDMOS transistor | |
| Fabricantes | NXP Semiconductors | |
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BLF6G38-50; BLF6G38LS-50www.DataSheet4U.com
WiMAX power LDMOS transistor
Rev. 01 — 12 February 2008
Preliminary data sheet
1. Product profile
1.1 General description
50 W LDMOS power transistor for base station applications at frequencies from
3400 MHz to 3800 MHz.
Table 1. Typical performance
Typical RF performance at Tcase = 25 °C in a class-AB production test circuit.
Mode of operation f
VDS PL(AV) PL(M)[1] Gp ηD ACPR885k ACPR1980k
(MHz)
(V) (W) (W)
(dB) (%) (dBc)
(dBc)
1-carrier N-CDMA[2] 3400 to 3600 28 9
70
14 23 −49[3]
−64[3]
[1] PL(M) stands for peak output power.
[2] Single carrier N-CDMA with pilot, paging, sync and 6 traffic channels (Walsh codes 8 - 13). PAR = 9.7 dB at
0.01 % probability on the CCDF. Channel bandwidth is 1.23 MHz.
[3] Measured within 30 kHz bandwidth.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
I Typical 1-carrier N-CDMA performance (Single carrier N-CDMA with pilot, paging,
sync and 6 traffic channels [Walsh codes 8 - 13]. PAR = 9.7 dB at 0.01 % probability
on the CCDF. Channel bandwidth is 1.23 MHz) at a frequency of 3400 MHz, 3500 MHz
and 3600 MHz, a supply voltage of 28 V, an IDq of 450 mA, a power gain of 14 dB, a
drain efficiency of 23 % and a peak output power of 70 W:
I Qualified up to a maximum VDS operation of 32 V
I Suitable for operation in the 3.4 GHz to 3.8 GHz frequency range
I Integrated ESD protection
I Excellent ruggedness
I High efficiency
I Excellent thermal stability
I Designed for broadband operation
I Internally matched for ease of use
I Low gold plating thickness on leads
1 page  
NXP Semiconductors
BLF6G38-50; BLF6G38LS-50
www.DataSheet4U.com
WiMAX power LDMOS transistor
−20
ACPR
(dBc)
−30
−40
001aah397
(1)
−50
(2)
(3)
−60
−70
0 4 8 12
PL(AV) (W)
VDS = 28 V; IDq = 450 mA; f = 3500 MHz.
(1) f = 10 MHz
(2) f = 20 MHz
(3) f = 30 MHz
Fig 3. Adjacent channel power ratio as a function of average load power; typical values
7.3 Single carrier N-CDMA broadband performance at 9 W average
7.3.1 Graphs
16
Gp
(dB)
15
14
13
12
11
Gp
ηD
001aah398
26
ηD
(%)
25
24
23
22
21
−40
ACPR
(dBc)
−50
−60
001aah399
(1) ACPR885k
(2)
ACPR1500k
(1)
(2)
ACPR1980k
(1)
(2)
10
3400
3450
3500
20
3550
3600
f (MHz)
−70
3400
3450
3500
3550
3600
f (MHz)
VDS = 28 V; IDq = 450 mA; Single Carrier N-CDMA;
PAR = 9.7 dB at 0.01 % probability; IBW = 30 kHz.
Fig 4. Power gain and drain efficiency as functions of
frequency; typical values
VDS = 28 V; IDq = 450 mA; Single Carrier N-CDMA;
PAR = 9.7 dB at 0.01 % probability; IBW = 30 kHz.
(1) Low frequency component
(2) High frequency component
Fig 5. Adjacent channel power ratio as a function of
frequency; typical values
BLF6G38-50_BLF6G38LS-50_1
Preliminary data sheet
Rev. 01 — 12 February 2008
© NXP B.V. 2008. All rights reserved.
5 of 12
5 Page 
NXP Semiconductors
BLF6G38-50; BLF6G38LS-50
www.DataSheet4U.com
WiMAX power LDMOS transistor
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
BLF6G38-50_BLF6G38LS-50_1
Preliminary data sheet
Rev. 01 — 12 February 2008
© NXP B.V. 2008. All rights reserved.
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