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PDF ICS8430-51 Data sheet ( Hoja de datos )

Número de pieza ICS8430-51
Descripción LOW JITTER LVCMOS/LVTTL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
Fabricantes Integrated Circuit Systems 
Logotipo Integrated Circuit Systems Logotipo



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No Preview Available ! ICS8430-51 Hoja de datos, Descripción, Manual

Integrated
Circuit
Systems, Inc.
PRELIMINARY
ICS8430-51
600MHZ, LOW JITTER
LVCMOS/ LVTTL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
GENERAL DESCRIPTION
The ICS8430-51 is a general purpose, dual output
,&6 Crystal-to-3.3V Differential LVPECL High Frequency
HiPerClockS™ Synthesizer and a member of the HiPerClockS™
family of High Performance Clock Solutions from
ICS. The ICS8430-51 has a selectable TEST_CLK
or crystal inputs. The VCO operates at a frequency range of
200MHz to 700MHz. With FOUT0 configured to divide the
VCO frequency by 2, output frequency steps as small as
2MHz can be achieved using a 16MHz crystal or reference clock.
FOUT1 provides an additional divide by 16 and 180° phase shift.
www.DOatuatpShuet efrte4qUu.ceonmcies up to 600MHz can be programmed using
the serial or parallel interfaces to the configuration logic. The low
jitter and frequency range of the ICS8430-51 make it an ideal
clock generator for most clock tree applications.
FEATURES
Dual differential 3.3V LVPECL outputs
Selectable crystal oscillator interface
or LVCMOS/LVTTL TEST_CLK
Maximum output frequency: 600MHz
Crystal input frequency range: 14MHz to 25MHz
VCO range: 200MHz to 700MHz
Parallel or serial interface for programming counter
and output dividers
RMS period jitter: 2.6ps (typical)
Cycle-to-cycle jitter: 17ps (typical)
3.3V supply voltage
0°C to 70°C ambient operating temperature
Industrial temperature information available upon request
BLOCK DIAGRAM
PIN ASSIGNMENT
VCO_SEL
XTAL_SEL
TEST_CLK
XTAL1
XTAL2
OSC
0
1
÷ 16
MR
S_LOAD
S_DATA
S_CLOCK
nP_LOAD
M0:M8
N0:N2
PLL
PHASE DETECTOR
VCO
÷M
÷2
0
÷N
1
CONFIGURATION
INTERFACE
LOGIC
÷16
M5
M6
M7
M8
N0
N1
N2
VEE
FOUT0
nFOUT0
FOUT1
nFOUT1
32 31 30 29 28 27 26 25
1 24
2 23
3 22
4 ICS8430-51 21
5 20
6 19
7 18
8 17
9 10 11 12 13 14 15 16
XTAL1
TEST_CLK
XTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
MR
TEST
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on initial
product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications without notice.
8430AY-51
www.icst.com/products/hiperclocks.html
REV. D FEBRUARY 11, 2003
1

1 page




ICS8430-51 pdf
Integrated
Circuit
Systems, Inc.
PRELIMINARY
ICS8430-51
600MHZ, LOW JITTER
LVCMOS/ LVTTL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
TABLE 3C. PROGRAMMABLE OUTPUT DIVIDER FUNCTION TABLE
N2
0
0
0
0
1
1
www.DataSheet4U.com
1
1
Inputs
N1
0
0
1
1
0
0
1
1
N Divider Value
N0
02
14
08
1 16
01
12
04
18
FOUT0, nFOUT0 Output Frequency
(MHz)
Minimum
Maximum
100 350
50 175
25 87.5
12.5 43.75
200 600
100 350
50 175
25 87.5
nFOUT0
FOUT0
nFOUT1
FOUT1
FIGURE 2. FOUTX TIMING DIAGRAM
8430AY-51
www.icst.com/products/hiperclocks.html
5
REV. D FEBRUARY 11, 2003

5 Page





ICS8430-51 arduino
Integrated
Circuit
Systems, Inc.
PRELIMINARY
ICS8430-51
600MHZ, LOW JITTER
LVCMOS/ LVTTL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
The following component footprints are used in this layout
example: All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors C14 and C15 as close as pos-
sible to the power pins. If space allows, placing the decoupling
capacitor at the component side is preferred. This can reduce
unwanted inductance between the decoupling capacitor and the
power pin generated by the via.
Maximize the pad size of the power (ground) at the decoupling
capacitor. Maximize the number of vias between power (ground)
and the pads. This can reduce the inductance between the power
www.D(agtraouShnede) pt4laUn.ceoamnd the component power (ground) pins.
If VCCA shares the same power supply with VCC, insert the RC
filter R7, C11, and C16 in between. Place this RC filter as close
to the VCCA as possible.
CLOCK TRACES AND TERMINATION
The component placements, locations and orientations should be
arranged to achieve the best clock signal quality. Poor clock signal
quality can degrade the system performance or cause system fail-
ure. In the synchronous high-speed digital system, the clock signal
is less tolerable to poor signal quality than other signals. Any ring-
ing on the rising or falling edge or excessive ring back can cause
system failure. The trace shape and the trace delay might be re-
stricted by the available space on the board and the component
location. While routing the traces, the clock signal traces should be
routed first and should be locked prior to routing other signal traces.
• The traces with 50transmission lines TL1 and TL2 at
FOUT and nFOUT should have equal delay and run ad-
jacent to each other.Avoid sharp angles on the clock trace.
Sharp angle turns cause the characteristic impedance to
change on the transmission lines.
• Keep the clock trace on the same layer. Whenever pos-
sible, avoid any vias on the clock traces. Any via on the
trace can affect the trace characteristic impedance and
hence degrade signal quality.
• To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow more space between the clock trace
and the other signal trace.
• Make sure no other signal trace is routed between the
clock trace pair.
The matching termination resistors R1, R2, R3 and R4 should
be located as close to the receiver input pins as possible. Other
termination schemes can also be used but are not shown in
this example.
CRYSTAL
The crystal X1 should be located as close as possible to the pins
24 (XTAL1) and 25 (XTAL2). The trace length between the X1
and U1 should be kept to a minimum to avoid unwanted parasitic
inductance and capacitance. Other signal traces should not be
routed near the crystal traces.
8430AY-51
X1 GND
U1
PIN 1
VCC
VIA
C15
C14
C11
R7
C16
VCCA
TL1N
Close to the input
pins of the
receiver
R4
R3
TL1
TL1, TL2 are 50 Ohm traces and
equal length
R2
R1
FIGURE 6B. PCB BOARD LAYOUT FOR ICS8430-51
www.icst.com/products/hiperclocks.html
11
REV. D FEBRUARY 11, 2003

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