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PDF GS8342D18E-200 Data sheet ( Hoja de datos )

Número de pieza GS8342D18E-200
Descripción 36Mb SigmaQuad-II Burst
Fabricantes GSI Technology 
Logotipo GSI Technology Logotipo



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No Preview Available ! GS8342D18E-200 Hoja de datos, Descripción, Manual

Preliminary
GS8342D08/09/18/36Ew-3w3w3.D/3at0a0Sh/2ee5t04U/2.c0o0m/167
165-Bump BGA
Commercial Temp
Industrial Temp
36Mb SigmaQuad-II
Burst of 4 SRAM
167 MHz–333 MHz
1.8 V VDD
1.8 V and 1.5 V I/O
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
• Pin-compatible with present 9Mb and 18Mb and future 72Mb
and 144Mb devices
SigmaQuadFamily Overview
The GS8342D08/09/18/36E are built in compliance with the
SigmaQuad-II SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 37,748,736-bit (36Mb)
SRAMs. The GS8342D08/18/36E SigmaQuad SRAMs are
just one element in a family of low power, low voltage HSTL
I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS8342D08/09/18/36E SigmaQuad-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
Bottom View
165-Bump, 15 mm x 17 mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Because Separate I/O SigmaQuad-II B4 RAMs always transfer
data in four packets, A0 and A1 are internally set to 0 for the
first read or write transfer, and automatically incremented by 1
for the next transfers. Because the LSBs are tied off internally,
the address field of a SigmaQuad-II B4 RAM is always two
address pins less than the advertised index depth (e.g., the 2M
x 18 has a 512K addressable index).
Parameter Synopsis
tKHKH
tKHQV
- 333
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.50 ns
Rev: 1.02 8/2005
1/37
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

1 page




GS8342D18E-200 pdf
Preliminary
GS8342D08/09/18/36E-333/300/250/200/167
www.DataSheet4U.com
4M x 8 SigmaQuad-II SRAM—Top View
123456789
A
CQ
MCL/SA
(72Mb)
SA
W NW1 K
NC
R
SA
B NC NC NC SA NC K NW0 SA NC
C NC NC NC VSS SA NC SA VSS NC
D NC D4 NC VSS VSS VSS VSS VSS NC
E
NC
NC
Q4
VDDQ
VSS
VSS
VSS VDDQ NC
F
NC
NC
NC
VDDQ
VDD
VSS
VDD VDDQ NC
G
NC
D5
Q5
VDDQ
VDD
VSS
VDD VDDQ NC
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
J
NC
NC
NC
VDDQ
VDD
VSS
VDD VDDQ NC
K
NC
NC
NC
VDDQ
VDD
VSS
VDD VDDQ NC
L
NC
Q6
D6
VDDQ
VSS
VSS
VSS VDDQ
NC
M NC NC NC VSS VSS VSS VSS VSS NC
N NC D7 NC VSS SA SA SA VSS NC
P NC NC Q7 SA SA C SA SA NC
R
TDO TCK
SA
SA
SA
C
SA SA SA
11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch
Notes:
1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.
2. MCL = Must Connect Low
10
SA
NC
NC
NC
D2
NC
NC
VREF
Q1
NC
NC
NC
NC
NC
TMS
11
CQ
Q3
D3
NC
Q2
NC
NC
ZQ
D1
NC
Q0
D0
NC
NC
TDI
Rev: 1.02 8/2005
5/37
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

5 Page





GS8342D18E-200 arduino
Preliminary
GS8342D08/09/18/36E-333/300/250/200/167
www.DataSheet4U.com
Rev: 1.02 8/2005
11/37
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

11 Page







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