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PDF TGA2924-SG Data sheet ( Hoja de datos )
| Número de pieza | TGA2924-SG | |
| Descripción | 10 Watt MMDS Packaged Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Advance Product Information
wwAwu.Dgata1S6h,ee2t04U0.c5om
10 Watt MMDS Packaged Amplifier
TGA2924-SG
Key Features
• 2. 6 GHz Application Frequency Range
• 12 dB Nominal Gain
• 40 dBm Nominal Psat
• 2.5% EVM at 30 dBm output power
• Internally Partially Matched
• IMD3 -45 dBc @ 28 dBm SCL, Typical
• Bias Conditions: 8 V @ 1.2 A (Quiescent)
• 0.5 µm HFET Technology
• 2 lead Cu-alloy base package
Primary Applications
• MMDS Pt-Pt and Pt-Multi Pt Radio
• S-Band Power Amplifiers
Product Description
The TGA2924-SG HPA provides 12
dB of gain, 10 W of output power at
2.6 GHz and 2.5% EVM at 30 dBm
output power. The device is ideally
suited for high linearity, high power
wireless data applications such as
MMDS Point-to-Point or Point-to-
Multi-Point radios. The package has
a high thermal conductivity copper
alloy base. Internal partial matching
simplifies system board layout by
requiring a minimum of external
components.
Fixtured Measured Performance
Bias Conditions: Vd = 8 V, Idq =1.2 A
Performance data taken in a 2.6 GHz application circuit
15
10
5
0
-5
-10
-15
-20
-25
2
S21
S11
S22
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9
3
Lead-Free & RoHS compliant.
Evaluation Boards are available.
Frequency (GHz)
40.5
40
39.5
39 P2dB
38.5
38 P1dB
37.5
37
36.5
36
35.5
2.4 2.45 2.5 2.55 2.6 2.65 2.7 2.75 2.8
Frequency (GHz)
Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to
change without notice.
1
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
1 page  
Advance Product Information
wwAwu.Dgata1S6h,ee2t04U0.c5om
TGA2924-SG
Measured Fixtured Data
Application Circuit tuned to 2.6 GHz
Bias Conditions: Vd = 8 V, Idq = 1.2 A
41
39
37 2.45GHz
35 2.5GHz
2.55GHz
33
2.6GHz
31 2.65GHz
29 2.7GHz
2.75GHz
27
19 21 23 25 27 29 31 33 35
Pin (dBm)
50
45
40
35
30
25
20
15
10
5
0
19 21 23 25 27 29 31 33 35
Pin (dBm)
2.45GHz
2.5GHz
2.55GHz
2.6GHz
2.65GHz
2.7GHz
2.75GHz
2400
2200
2000
1800
1600
2.45GHz
2.5GHz
2.55GHz
2.6GHz
2.65GHz
2.7GHz
2.75GHz
1400
1200
19 21 23 25 27 29 31 33 35
Pin (dBm)
5
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
5 Page 
Advance Product Information
wwAwu.Dgata1S6h,ee2t04U0.c5om
TGA2924-SG
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and
Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak
Temperature
Ramp-down Rate
SnPb
3 °C/sec
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
240 °C
10 – 20 sec
4 – 6 °C/sec
Pb Free
3 °C/sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
260 °C
10 – 20 sec
4 – 6 °C/sec
Ordering Information
Part
TGA2924-SG
Package Style
Gullwing Leads
11
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGA2924-SG.PDF ] | |
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