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PDF TC1313 Data sheet ( Hoja de datos )

Número de pieza TC1313
Descripción 500 mA Synchronous Buck Regulator /+ 300 mA LDO
Fabricantes Microchip Technology 
Logotipo Microchip Technology Logotipo



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TC1313
500 mA Synchronous Buck Regulator,
+ 300 mA LDO
Features
• Dual-Output Regulator (500 mA Buck Regulator
and 300 mA Low-Dropout Regulator (LDO))
• Total Device Quiescent Current = 57 µA (Typical)
• Independent Shutdown for Buck and LDO
Outputs
• Both Outputs Internally Compensated
• Synchronous Buck Regulator:
- Over 90% Typical Efficiency
- 2.0 MHz Fixed-Frequency PWM
(Heavy Load)
- Low Output Noise
- Automatic PWM-to-PFM mode transition
- Adjustable (0.8V to 4.5V) and Standard
Fixed-Output Voltages (0.8V, 1.2V, 1.5V,
1.8V, 2.5V, 3.3V)
• Low-Dropout Regulator:
- Low-Dropout Voltage = 137 mV Typical @
200 mA
- Standard Fixed-Output Voltages
(1.5V, 1.8V, 2.5V, 3.3V)
• Small 10-pin 3x3 DFN or MSOP Package Options
• Operating Junction Temperature Range:
- -40°C to +125°C
• Undervoltage Lockout (UVLO)
• Output Short Circuit Protection
• Overtemperature Protection
Applications
• Cellular Phones
• Portable Computers
• USB-Powered Devices
• Handheld Medical Instruments
• Organizers and PDAs
Description
The TC1313 device combines a 500 mA synchronous
buck regulator and 300 mA Low-Dropout Regulator
(LDO) to provide a highly integrated solution for
devices that require multiple supply voltages. The
unique combination of an integrated buck switching
regulator and low-dropout linear regulator provides the
lowest system cost for dual-output voltage applications
that require one lower processor core voltage and one
higher bias voltage.
The 500 mA synchronous buck regulator switches at a
fixed frequency of 2.0 MHz when the load is heavy,
providing a low-noise, small-size solution. When the
load on the buck output is reduced to light levels, it
changes operation to a Pulse Frequency Modulation
(PFM) mode to minimize quiescent current draw from
the battery. No intervention is necessary for smooth
transition from one mode to another.
The LDO provides a 300 mA auxiliary output that
requires a single 1 µF ceramic output capacitor,
minimizing board area and cost. The typical dropout
voltage for the LDO output is 137 mV for a 200 mA
load.
The TC1313 device is available in either the 10-pin DFN
or MSOP package.
Additional protection features include: UVLO,
overtemperature and overcurrent protection on both
outputs.
For a complete listing of TC1313 standard parts,
consult your Microchip representative.
Package Type
10-Lead DFN *
SHDN2 1
VIN2 2
VOUT2 3
NC 4
AGND 5
10 PGND
9 LX
EP
11
8 VIN1
7 SHDN1
6 VFB1/VOUT1
SHDN2
VIN2
VOUT2
NC
AGND
10-Lead MSOP
1 10 PGND
2 9 LX
3 8 VIN1
4 7 SHDN1
5 6 VFB1/VOUT1
* Includes Exposed Thermal Pad (EP); see Table 3-1.
© 2009 Microchip Technology Inc.
DS21974B-page 1

1 page




TC1313 pdf
TC1313
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - AGND ......................................................................6.0V
All Other I/O ...............................(AGND - 0.3V) to (VIN + 0.3V)
LX to PGND...............................................-0.3V to (VIN + 0.3V)
PGND to AGND .................................................. -0.3V to +0.3V
Output Short Circuit Current ................................ Continuous
Power Dissipation (Note 7) .......................... Internally Limited
Storage temperature .....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM) ....................................... 3 kV
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† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Characteristics: VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1µF, L = 4.7 µH, VOUT1 (ADJ) = 1.8V,
IOUT1 = 100 ma, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym
Min Typ Max Units
Conditions
Input/Output Characteristics
Input Voltage
Maximum Output Current
Maximum Output Current
Shutdown Current
Combined VIN1 and VIN2 Current
Operating IQ
VIN
IOUT1_MAX
IOUT2_MAX
IIN_SHDN
IQ
Synchronous Buck IQ
LDO IQ
2.7
500
300
0.05
57
38
44
5.5
1
100
V Note 1, Note 2, Note 8
mA Note 1
mA Note 1
µA SHDN1 = SHDN2 = GND
µA SHDN1 = SHDN2 = VIN2
IOUT1 = 0 mA, IOUT2 = 0 mA
µA SHDN1 = VIN, SHDN2 = GND
µA SHDN1 = GND, SHDN2 = VIN2
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN1,SHDN2,
Logic Input Voltage Low
VIL — — 15 %VIN VIN1 = VIN2 = 2.7V to 5.5V
SHDN1,SHDN2,
Logic Input Voltage High
VIH 45 — — %VIN VIN1 = VIN2 = 2.7V to 5.5V
SHDN1,SHDN2,
Input Leakage Current
IIN
-1.0 ±0.01 1.0
µA VIN1 = VIN2 = 2.7V to 5.5V
SHDNX = GND
SHDNY = VIN
Thermal Shutdown
TSHD
— 165 —
°C Note 6, Note 7
Thermal Shutdown Hysteresis
TSHD-HYS
10
°C
Undervoltage Lockout
(VOUT1 and VOUT2)
UVLO
2.4 2.55 2.7
V VIN1 Falling
Undervoltage Lockout Hysteresis UVLO-HYS
200
mV
Note
1:
2:
3:
4:
The Minimum VIN has to meet two conditions: VIN 2.7V and VIN VRX + VDROPOUT, VRX = VR1 or VR2.
VRX is the regulator output voltage setting.
TCVOUT2 = ((VOUT2max – VOUT2min) * 106)/(VOUT2 * DT).
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
7: The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
8: VIN1 and VIN2 are supplied by the same input source.
© 2009 Microchip Technology Inc.
DS21974B-page 5

5 Page





TC1313 arduino
TC1313
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Note: Unless otherwise indicated, VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 = CIN = 4.7 µF, COUT2 = 1 µF, L = 4.7 µH,
VOUT1 (ADJ) = 1.8V, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. TA = +25°C. Adjustable or fixed-
output voltage options can be used to generate the Typical Performance Characteristics.
FIGURE 2-19:
VOUT1 and VOUT2 Heavy
Load Switching Waveforms vs. Time.
1.802
1.800
IOUT2 = 150 mA
TA = + 85°C
1.798
1.796
TA = + 25°C
1.794
TA = - 40°C
SHDN1 = AGND
SHDN2 = VIN2
1.792
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
Input Voltage (V)
FIGURE 2-22:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 1.8V).
FIGURE 2-20:
VOUT1 and VOUT2 Light
Load Switching Waveforms vs. Time.
2.508
2.506
IOUT2 = 150 mA
2.504
TA = + 85°C
SHDN1 = AGND
SHDN2 = VIN2
2.502
2.500
TA = + 25°C
2.498
TA = - 40°C
2.496
3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
Input Voltage (V)
FIGURE 2-23:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 2.5V).
1.492
1.49
IOUT2 = 150 mA
TA = + 85°C
1.488
1.486
1.484
TA = + 25°C
TA = - 40°C
SHDN1 = AGND
SHDN2 = VIN2
1.482
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
Input Voltage (V)
FIGURE 2-21:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 1.5V).
3.298
3.297
IOUT2 = 150 mA
3.296
TA = + 85°C
SHDN1 = AGND
SHDN2 = VIN2
3.295
3.294
3.293
TA = + 25°C
TA = - 40°C
3.292
3.60
3.92
4.23 4.55 4.87
Input Voltage (V)
5.18
5.50
FIGURE 2-24:
VOUT2 Output Voltage vs.
Input Voltage (VOUT2 = 3.3V).
© 2009 Microchip Technology Inc.
DS21974B-page 11

11 Page







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