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PDF EMIF02-USB03F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-USB03F2 | |
| Descripción | 2 LINES EMI FILTER INCLUDING ESD PROTECTION | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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®
IPAD™
EMIF02-USB03F2
2 LINES EMI FILTER
INCLUDING ESD PROTECTION
PRODUCT CHARACTERISTICS
ESD protection and EMI filtering for:
■ USB OTG port
DESCRIPTION
The EMIF02-USB03F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
OTG (On The Go).
The EMIF02-USB03F2 Flip-Chip packaging means
the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV on external contacts.
Flip-Chip
(11 Bumps)
Figure 1: Pin Configuration (ball side)
BENEFITS
■ 2 lines low-pass-filter + 2 lines ESD protection
■ High efficiency in EMI filtering
■ Lead Free package
■ Very low PCB space consuming: < 3.25 mm2
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
(IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
■ integration and wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on external pins 15kV (air discharge)
8kV (contact discharge)
Level 1 on internal pins 2kV (air and contact
discharge)
Table 1: Order Code
Part Number
EMIF02-USB03F2
Marking
FU
321
ID Dz
Vbus Pup
Pd1
D+
out
Pd2
D+
in
D-
out
GND
D-
in
Figure 2: Schematic
EMIF02-USB03F2
D+OUT
D-OUT
R2=33Ω
R1=33Ω
CC
R5=15kΩ
Pup
R3=1.3kΩ
R4=17kΩ
Pd2
Pd1
Cline = 20 pF max.
A
B
C
D
Dz ID Vbus
D+IN
D-IN
TM: IPAD is a trademark of STMicroelectronics.
October 2004
REV. 3
1/7
1 page  
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EMIF02-USB03F2
Figure 11: Order Code
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 12: FLIP-CHIP Package Mechanical Data
500µm ± 50
315µm ± 50
650µm ± 65
1.57mm ± 50µm
Figure 14: Foot Print Recommendations
Copper pad Diameter :
250µm recommended, 300µm max.
Solder stencil opening :
330µm recommended
Solder mask opening recommendation :
340µm min. for 300µm copper pad diameter
Figure 15: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
(y = year
ww = week)
All dimensions in µm
565 400
E
xxz
y ww
5/7
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-USB03F2.PDF ] | |
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