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PDF EMIF02-SPK01C2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-SPK01C2 | |
| Descripción | 2 line EMI filter and ESD protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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IPAD™
EMIF02-SPK01C2
2 line EMI filter and ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers and printers and MCU Boards
Description
The EMIF02-SPK01C2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The Flip-Chip packaging means the
package size is equal to the die size.
This filter includes ESD protection circuitry, which
prevents damage to the application when it is
subjected to ESD surges up to 15 kV.
Benefits
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency EMI filter (-33 dB @ 900 MHz)
■ Very low PCB space consumption:
1.07 mm x 1.47 mm
■ Very thin package: 0.695 mm
■ Coating resin on back side and lead free
package
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging.
Coated Flip-Chip package
(about 20 times real size)
Pin configuration (Bump side)
321
I2 I1 A
GND
O2 O1
B
C
Complies with following standards:
IEC 61000-4-2
level 4 input pins
level 1 output pins
15 kV
8 kV
2 kV
2 kV
(air discharge)
(contact discharge
(air discharge)
(contact discharge
MIL STD 883G - Method 3015-7 Class 3
January 2007
Rev 1
www.st.com
1/7
1 page  
EMIF02-SPK01C2
2 Ordering information scheme
Ordering infworwmwa.DtiaotanSshecehte4Um.ceom
EMIF yy - xxx zz Cx
EMI Filter
Number of lines
Information
3 letters = application
2 digits = version
Package
C = Coated Flip-Chip
x = 2: Leadfree Pitch = 500 µm, Bump = 315 µm
3 Package information
Figure 9. Flip-Chip Dimensions
500 µm ± 10
250 µm ± 10
315 µm ± 50
695 µm ± 50
1.07 mm ± 50 µm
Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
E
xxz
y ww
Figure 11. Footprint recommendation
Copper pad Diameter:
250µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-SPK01C2.PDF ] | |
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