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PDF EMIF02-MIC01F2 Data sheet ( Hoja de datos )

Número de pieza EMIF02-MIC01F2
Descripción 2-line IPAD EMI filter including ESD protection
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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EMIF02-MIC01F2
2-line IPAD™, EMI filter including ESD protection
Features
2-line symetrical low-pass filter
Lead-free package
High-density capacitor
High-efficiency EMI filtering
Very small PCB footprint: 1.42 mm x 1.92 mm
Very thin package: 0.65 mm
High-efficiency ESD suppression
(IEC 61000-4-2 level 4)
High reliability offered by monolithic integration
Complies with the standards:
IEC61000-4-2 Level 4 on inputs and outputs
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
Mobile phones (differential microphone filtering
and ESD protection).
Description
The EMIF02-MIC01F2 is a highly integrated
device designed to suppress EMI / RFI noise for
microphone line filtering.
The EMIF02-MIC01F2 Flip Chip packaging
means the package size is equal to the die size.
This is why the EMIF02-MIC01F2 is a very small
device.
Additionally, the filter includes an ESD protection
circuit to prevent damage to the protected device
when subjected to ESD surges up to 15 kV.
Flip Chip
11 bumps
Figure 1. Pin configuration (bump side
view)
4321
A
B
C
Figure 2. Schematic
B4
To Mic
C4
GND
GND
C1
R1
R2
C2
GND
GND
A3,B2,B3,C3 are ground pins
A4
Meas
GND
GND
C5
GND
Vcc
A2
C3 R3 R5
C4 R4 R6
C2
GND GND
C6
B1
to pre-amp
C1codec
GND
GND
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 6
1/7
www.st.com
7

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EMIF02-MIC01F2 pdf
EMIF02-MIC01F2
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Figure 9. Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
Figure 11. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.56
0.73 ± 0.05
All dimensions in mm
4 ± 0.1
User direction of unreeling
4
Note:
Ordering information
Table 3. Ordering information
Order code
Marking Package
EMIF02-MIC01F2
GB Flip Chip
Weight
3.8 mg
Base qty
5000
Delivery mode
Tape and reel (7”)
More packing information is available in the application notes:
AN1235: “Flip Chip: package description and recommendations for use”
AN 1751: “EMI filters: Recomendations and measurements”
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