DataSheet.es    


PDF BLA0912-250R Data sheet ( Hoja de datos )

Número de pieza BLA0912-250R
Descripción Avionics LDMOS power transistor
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



Hay una vista previa y un enlace de descarga de BLA0912-250R (archivo pdf) en la parte inferior de esta página.


Total 13 Páginas

No Preview Available ! BLA0912-250R Hoja de datos, Descripción, Manual

BLA0912-250R
Avionics LDMOS power transistor
Rev. 01 — 3 March 2010
www.DataSheet4U.com
Product data sheet
1. Product profile
1.1 General description
Silicon N-channel enhancement mode LDMOS transistor encapsulated in a 2-lead
SOT502A flange package with a ceramic cap. The common source is connected to the
mounting flange.
Table 1. Test information
Typical RF performance measured in common source class-AB test circuit at PL = 250 W and 960 MHz to 1215 MHz
frequency band. Th = 25 °C; Zth(j-h) = 0.15 K/W; unless otherwise specified.
Mode of operation f
tp δ VDS PL Gp ΔGp ηD Pdroop(pulse) tr tf Zth(j-h) ϕins(rel)
(MHz)
(μs) % (V) (W) (dB) (dB) (%) (dB)
(ns) (ns) (K/W) (deg)
all modes
960 to 1215 100 10 36 250 13.5 0.8 50 0.1
25 6 0.18 ±5
TCAS
1030 to 1090 32 0.1 36 250 14.0 0.8 50 0
25 6 0.07 ±5
Mode-S
1030 to 1090 128 2 36 250 13.5 0.8 50 0.1
25 6 0.15 ±5
1030 to 1090 340 1 36 250 13.5 0.8 50 0.2
25 6 0.20 ±5
JTIDS
960 to 1215 3300 22 36 200 13.0 1.2 45 0.2
25 6 0.45 ±5
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
„ High power gain
„ Easy power control
„ Excellent ruggedness
„ Source on mounting base eliminates DC isolators, reducing common mode
inductance.
1.3 Applications
„ Avionics transmitter applications in the 960 MHz to 1215 MHz frequency range such
as Mode-S, TCAS and JTIDS, DME or TACAN.

1 page




BLA0912-250R pdf
NXP Semiconductors
BLA0912-250Rwww.DataSheet4U.com
Avionics LDMOS power transistor
Table 9. Layout details
See Figure 2.
Striplines are on a Rodgers Duroid 6010 Printed-Circuit Board (PCB); εr = 10.2 F/m;
thickness = 0.64 mm
Component Description
Dimensions
Input circuit
L1
stripline
5 mm × 0.8 mm
C1
stripline
1.2 mm × 3.5 mm
L2
stripline
capacitor pad: 1 mm × 1 mm (1×)
curve: width 0.8 mm; angle 90°; radius 0.8 mm (10×)
vertical: 3.9 mm × 0.8 mm (2×)
vertical: 9.4 mm × 0.8 mm (3×)
horizontal: 0.5 mm × 0.8 mm (4×)
L3
stripline
3 mm × 2 mm
C2
stripline
4 mm × 6.5 mm
L4
stripline
5 mm × 1 mm
C3
stripline
8.8 mm × 30 mm + 0.2 mm × 13 mm
Output circuit
C4
stripline
0.2 mm × 13 mm + 19 mm × 17.1 mm
L5
stripline
2.5 mm × 2.3 mm
L6
stripline
4 mm × 1 mm
C5
stripline
3 mm × 6.6 mm
L7
stripline
curve: width 0.8 mm; angle 90°; radius 0.8 mm (6×)
vertical: 2.2 mm × 0.8 mm (2×)
vertical: 6 mm × 0.8 mm (1×)
horizontal: 1 mm × 0.8 mm (2×)
L8
stripline
2.5 mm × 0.8 mm
1/4 λ line
stripline
curve: width 1 mm; angle 90°; radius 0.8 mm
vertical: 5 mm × 1 mm
horizontal: 19 mm × 1 mm
BLA0912-250R_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 3 March 2010
© NXP B.V. 2010. All rights reserved.
5 of 13

5 Page





BLA0912-250R arduino
NXP Semiconductors
BLA0912-250Rwww.DataSheet4U.com
Avionics LDMOS power transistor
12. Legal information
12.1 Data sheet status
Document status[1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
BLA0912-250R_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 3 March 2010
© NXP B.V. 2010. All rights reserved.
11 of 13

11 Page







PáginasTotal 13 Páginas
PDF Descargar[ Datasheet BLA0912-250R.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
BLA0912-250Avionics LDMOS transistorNXP Semiconductors
NXP Semiconductors
BLA0912-250RAvionics LDMOS power transistorNXP Semiconductors
NXP Semiconductors

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar