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PDF EMIF01-TV01F3 Data sheet ( Hoja de datos )
| Número de pieza | EMIF01-TV01F3 | |
| Descripción | Single line IPAD EMI filter and ESD protection | |
| Fabricantes | STMicroelectronics | |
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EMIF01-TV01F3
Single line IPAD™, EMI filter and ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency EMI filtering
■ Lead-free package
■ 400 µm pitch
■ Very low PCB space occupation: 0.6 mm2
■ Very thin package: 0.6 mm
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements through CSP
integration
Complies with the following standards
■ IEC 61000-4-2 level 4 on internal and external
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883F - Method 3015.7 Class 3
Application
■ TV analog signal in TV_OUT interface
Description
The EMIF01-TV01F3 is a highly integrated array
designed to suppress EMI/RFI noise and provide
impedance matching for mobile phone and
portable applications. The EMIF01-TV01F3 is in a
Flip Chip package to offer space saving and high
RF performance.
This low pass filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to
15 kV.
Flip Chip
(4 bumps)
Figure 1. Pin configuration (bump side)
AB
Pin Description
A1 TV OUT internal
A2 GND
1
2
Pin Description
B1 TV OUT external
B2 GND
Figure 2. Device configuration
TV out
Internal
A1
R TV out
External
B1
GND
GND
April 2008
TM: IPAD is a trademark of STMicroelectronics.
Rev 2
1/8
www.st.com
8
1 page  
EMIF01-TV01F3
3 Ordering information scheme
Ordering infworwmwa.DtiaotanSshecehte4Um.ceom
Figure 9. Ordering information scheme
EMIF yy - xx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: Lead-free, pitch = 400 µm, bump = 255 µm
4 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 10. Package dimensions
400 µm ± 40
605 µm ± 55
185 µm ± 10 µm
770 µm ± 30 µm
255 µm ± 40
5/8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet EMIF01-TV01F3.PDF ] | |
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