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PDF LE82GM965 Data sheet ( Hoja de datos )

Número de pieza LE82GM965
Descripción Mobile Chipset
Fabricantes Intel 
Logotipo Intel Logotipo



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No Preview Available ! LE82GM965 Hoja de datos, Descripción, Manual

Mobile Intel® 965 Express
Chipset Family
Datasheet
Revision 003
June 2007
www.DataSheet4U.com

1 page




LE82GM965 pdf
4.11 (G)MCH Decode Rules and Cross-Bridge Address Mapping....................................... 63
4.11.1 Legacy VGA and I/O Range Decode Rules .................................................. 63
5 System Memory Controller ...................................................................................... 65
5.1 Functional Overview .......................................................................................... 65
5.2 Memory Channel Access Modes ........................................................................... 65
5.2.1 Dual Channel Interleaved Mode ................................................................ 66
5.2.1.1 Intel® Flex Memory Technology (Dual Channel Interleaved Mode with
Unequal Memory Population) ...................................................... 66
5.2.2 Dual Channel Non-Interleaved Mode ......................................................... 67
5.3 DRAM Technologies and Organization................................................................... 67
5.3.1 Rules for Populating SO-DIMM Slots.......................................................... 68
5.3.2 Pin Connectivity for Dual Channel Modes ................................................... 68
5.4 DRAM Clock Generation...................................................................................... 68
5.5 DDR2 On Die Termination................................................................................... 68
5.6 DRAM Power Management .................................................................................. 69
5.6.1 Self Refresh Entry and Exit Operation........................................................ 69
5.6.2 Dynamic Power Down Operation............................................................... 69
5.6.3 DRAM I/O Power Management ................................................................. 69
5.7 System Memory Throttling.................................................................................. 70
6 PCI Express Based External Graphics ...................................................................... 71
6.1 PCI Express Architecture .................................................................................... 71
6.1.1 Transaction Layer................................................................................... 71
6.1.2 Data Link Layer...................................................................................... 71
6.1.3 Physical Layer........................................................................................ 71
6.2 PCI Express Configuration Mechanism .................................................................. 72
6.3 Serial Digital Video Output (SDVO) ...................................................................... 73
6.3.1 SDVO Capabilities................................................................................... 73
6.3.2 Concurrent SDVO/PCI Express Operation ................................................... 74
6.3.2.1 SDVO Signal Mapping ................................................................ 75
6.4 SDVO Modes..................................................................................................... 76
7 Integrated Graphics Controller ................................................................................ 79
7.1 Graphics Processing........................................................................................... 80
7.1.1 3D Graphics Pipeline ............................................................................... 80
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7.1.2 3D Engine ............................................................................................. 80
7.1.2.1 Setup Engine............................................................................ 80
7.1.2.2 Rasterizer ................................................................................ 81
7.1.2.3 Texture Engine ......................................................................... 82
7.1.3 2D Engine ............................................................................................. 84
7.1.3.1 Video Graphics Array Registers ................................................... 85
7.1.3.2 Logical 128-Bit Fixed BLT and 256 Fill Engine ............................... 85
7.1.3.3 HW Rotation............................................................................. 85
7.1.4 Video Engine ......................................................................................... 86
7.1.4.1 Dynamic Video Memory Technology (DVMT 4.0)............................ 86
7.1.4.2 Intel® Clear Video Technology ................................................... 86
7.1.4.3 Sub-Picture Support .................................................................. 90
8 Graphics Display Interfaces ..................................................................................... 91
8.1 Display Overview .............................................................................................. 91
8.2 Display Planes .................................................................................................. 91
8.2.1 DDC (Display Data Channel) .................................................................... 92
8.2.1.1 Source/Destination Color Keying/ChromaKeying............................ 92
8.2.1.2 Gamma Correction .................................................................... 92
8.3 Display Pipes .................................................................................................... 92
8.3.1 Clock Generator Units (DPLL)................................................................... 92
Datasheet
5

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LE82GM965 arduino
Introduction
1 Introduction
Figure 1.
The Mobile Intel® 965 Express Chipset family is designed for use in Intel’s next
generation Intel® Centrino® Duo processor technology. Figure 1 provides a system
block diagram.
Intel® Centrino® Duo Processor Technology with Mobile Intel® 965 Express
Chipset Family (G)MCH
Analog CRT
2 SDVO
Ports
OR
Discrete
Graphics
Intel® Core™2 Duo
Processor for Mobile
Intel® 965 Express
Chipset Family
FSB
533/800 MHz
Analog TV
PCI Express
x16
Mobile Intel 965
Express Chipset
Family
Intel®
Management
Engine
LVDS Flat Panel
DDR2 SO-DIMMs
533/667 MHz
DMI
(x2/x4)
Controller
Link 0
Intel® Turbo
Memory
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WiFi Link
4965AGN
PCI Express
PCI Express
PCI Express
PCI Express
PCI Express*
6 PCI Express*
x1 Ports
Intel® 82566MM
Gigabit
Network Connection
GLCI
10/100 LCI
Intel®
Management
Engine
Intel® 82801
HEM/HBM
3 Ports
1 Port
SPI
LPC
USB 2.0
10 Ports
Controller Link 1
LPC
LPC
Power
Management
PCI
SMBUS 2.0
GPIO
Serial ATA
PATA
Intel® HD Audio
SPI Flash
FWH
TPM 1.2
SIO
PCI
Datasheet
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