PDF NBXDDA016 Data sheet ( Hoja de datos )

Número de pieza	NBXDDA016
Descripción	Clock Oscillator
Fabricantes	ON Semiconductor
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No Preview Available ! NBXDDA016, NBXDDB016 3.3 V, 133.33 MHz /137.93 MHz Dual Frequency CML Clock Oscillator The NBXDDB016/NBXDDA016 dual frequency crystal oscillator (XO) is designed to meet today’s requirements for 3.3 V CML clock generation applications. The device uses a high Q fundamental crystal and Phase Lock Loop (PLL) multiplier to provide selectable 133.33 MHz or 137.93 MHz, ultra low jitter and phase noise CML differential output. This device is a member of ON Semiconductor’s PureEdget clock family that provides accurate and precision clock solutions. Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape and reel in quantities of 1,000. Frequency stability options available as either 50 PPM NBXDDB016 or 20 PPM NBXDDA016. Features • CML Differential Output • Uses High Q Fundamental Mode Crystal and PLL Multiplier • Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz) • Selectable Output Frequency − 133.33 MHz (default)/137.93 MHz • Hermetically Sealed Ceramic SMD Package • RoHS Compliant • Operating Range 3.3 V ±10% • Total Frequency Stability − ±20 PPM or ±50 PPM Applications • High−End Servers www.Dat•aSBheaeste4sUta.ctoiomn • General Purpose Clock Generation and Margining VDD 6 CLK CLK 54 Crystal PLL Clock Multiplier http://onsemi.com 6 PIN CLCC LN SUFFIX CASE 848AB MARKING DIAGRAMS NBXDDB016 133.33/137.93 AWLYYWWG NBXDDA016 133.33/137.93 AWLYYWWG NBXDDA016 = NBXDDA016 (±50 PPM) NBXDDB016 = NBXDDB016 (±20 PPM) 133.33/137.93 = Output Frequency (MHz) A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NBXDDB016LN1TAG* CLCC−6 1000/ (Pb−Free) Tape & Reel NBXDDA016LN1TAG CLCC−6 1000/ (Pb−Free) Tape & Reel NBXDDA016LNHTAG CLCC−6 100/ (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. * Please contact sales office for availability 1 23 OE FSEL GND Figure 1. Simplified Logic Diagram © Semiconductor Components Industries, LLC, 2009 March, 2009 − Rev. 3 1 Publication Order Number: NBXDDA016/D 1 page NBXDDA016, NBXDDB016 Table 8. RELIABILITY COMPLIANCE Parameter ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁShock ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁSolderability ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVibration Solvent Resistance ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁThermal Shock ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁMoisture Level Sensitivity Standard Mechanical Mechanical Mechanical Mechanical Environment Environment Method MIL−STD−833, Method 2002, Condition B MIL−STD−833, Method 2003 MIL−STD−833, Method 2007, Condition A MIL−STD−202, Method 215 MIL−STD−833, Method 1011, Condition A MSL1 260°C per IPC/JEDEC J−STD−020D VTT = VDD NBXDDB016/NBXDDA016 Driver Device CLK CLK 50 W Z = 50 W Z = 50 W 50 W D Receiver Device D Figure 5. Typical CML Termination for Output Driver and Device Evaluation (See Application Note AND8173 − Termination of CML Devices) www.DataSheet4U.com Temperature (°C) 260 217 temp. 260°C 20 − 40 sec. max. peak 3°C/sec. max. ramp−up 175 150 pre−heat reflow 6°C/sec. max. cooling Time 60180 sec. 60150 sec. Figure 6. Recommended Reflow Soldering Profile http://onsemi.com 5 5 Page

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