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PDF UPG2406TB Data sheet ( Hoja de datos )

Número de pieza UPG2406TB
Descripción 0.01 to 3.0 GHz SPDT SWITCH
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DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2406TB
0.01 to 3.0 GHz SPDT SWITCH
DESCRIPTION
The μPG2406TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were designed for
mobile phone and another L, S-band application.
This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from
0.01 to 3.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin super minimold package. And this package is able to high-density surface
mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 1.8 to 5.3 V (2.7 V TYP.)
: Vcont (L) = 0.2 to +0.2 V (0 V TYP.)
• Low insertion loss
: Lins = 0.40 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: Lins = 0.47 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
• High isolation
: ISL = 27 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: ISL = 17 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
• Handling power
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: Pin (1 dB) = +30.5 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin super minimold package (2.0× 1.25 × 0.9 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
Order Number
μPG2406TB-E4 μPG2406TB-E4-A
Package
6-pin super minimold
(Pb-Free)
Marking
Supplying Form
G5L Embossed tape 8 mm wide
Pin 4, 5, 6 face the perforation side of the
tape
Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2406TB
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10747EJ01V0DS (1st edition)
Date Published January 2009 NS
Printed in Japan
2009

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UPG2406TB pdf
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μPG2406TB
EVALUATION CIRCUIT
C2
C1 1
RF1
2
3
RF2
C1
Vcont1
6
RFC
5 C1 Note
Vcont2
4
Note C1 : 0.01 to 0.05 GHz 10 000 pF
: 0.05 to 0.5 GHz 1 000 pF
: 0.5 to 3.0 GHz 56 pF
C2 : 1 000 pF
C2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1 LESD
C1
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
• The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
Data Sheet PG10747EJ01V0DS
5

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UPG2406TB arduino
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μPG2406TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
For soldering
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
IR260
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10747EJ01V0DS
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