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PDF TC58DVG02A1FT00 Data sheet ( Hoja de datos )
| Número de pieza | TC58DVG02A1FT00 | |
| Descripción | MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS | |
| Fabricantes | Toshiba Semiconductor | |
| Logotipo |  |
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TC58DVG02A1FT00
www.DataSheTetE4UN.cToAmTIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
1-GBIT (128M u 8 BITS) CMOS NAND E2PROM
DESCRIPTION
The TC58DVG02A1 is a single 3.3 V 1-Gbit (1,107,296,256) bit NAND Electrically Erasable and Programmable
Read-Only Memory (NAND E2PROM) organized as 528 bytes u 32 pages u 8192 blocks. The device has a 528-byte
static register which allows program and read data to be transferred between the register and the memory cell array
in 528-byte increments. The Erase operation is implemented in a single block unit (16 Kbytes 512 bytes: 528 bytes
u 32 pages).
The TC58DVG02A1 is a serial-type memory device which utilizes the I/O pins for both address and data
input/output as well as for command inputs. The Erase and Program operations are automatically executed making
the device most suitable for applications such as solid-state file storage, voice recording, image file memory for still
cameras and other systems which require high-density non-volatile memory data storage.
FEATURES
x Organization
Memory cell allay 528 u 256K u 8
Register
528 u 8
Page size
528 bytes
Block size
(16K 512) bytes
x Modes
Read, Reset, Auto Page Program,
Auto Block Erase, Status Read,
Multi Block Program, Multi Block Erase
x Mode control
Serial input/output
Command control
x Power supply
VCC 2.7 V to 3.6 V
x Program/Erase Cycles 1E5 cycle (with ECC)
x Access time
Cell array to register 25 Ps max
Serial Read Cycle 50 ns min
x Operating current
Read (50 ns cycle) 10 mA typ.
Program (avg.)
10 mA typ.
Erase (avg.)
10 mA typ.
Standby
50 PA max.
x Package
TSOPI48-P-1220-0.50 (Weight:
g typ.)
PIN ASSIGNMENT (TOP VIEW)
PIN NAMES
NC
NC
NC
NC
NC
GND
RY / BY
RE
CE
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE
WP
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48 NC
47 NC
46 NC
45 NC
44 I/O8
43 I/O7
42 I/O6
41 I/O5
40 NC
39 NC
38 NC
37 VCC
36 VSS
35 NC
34 NC
33 NC
32 I/O4
31 I/O3
30 I/O2
29 I/O1
28 NC
27 NC
26 NC
25 NC
I/O1 to I/O8
CE
WE
RE
CLE
ALE
WP
RY/BY
GND
VCC
VSS
I/O port
Chip enable
Write enable
Read enable
Command latch enable
Address latch enable
Write protect
Ready/Busy
Ground input
Power supply
Ground
000707EBA1
xTOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid
situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to
property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most
recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide
for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
xThe TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
xThe products described in this document are subject to the foreign exchange and foreign trade laws.
xThe information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or
others.
xThe information contained herein is subject to change without notice.
2003-01-10 1/44
1 page  
TC58DVG02A1FT00
www.DataSheet4U.com
Note: (1) CE High to Ready time depends on the pull-up resistor tied to the RY/BY pin.
(Refer to Application Note (9) toward the end of this document.)
(2) Sequential Read is terminated when tCEH is greater than or equal to 100 ns. If the RE to CE delay
is less than 30 ns, RY/BY signal stays Ready.
tCEH t 100 ns
* *: VIH or VIL
CE
RE
525 526 527 A
A : 0 to 30 ns oBusy signal is not output.
RY/BY
Busy
tCRY
PROGRAMMING AND ERASING CHARACTERISTICS
(Ta 0° to 70°C, VCC 2.7 V to 3.6 V)
SYMBOL
PARAMETER
MIN
tPROG
tDBSY
Programming Time
Dummy Busy Time for Multi Block
Programming
tMBPBSY
Multi Block Program Busy Time
Number of Programming Cycles on Same
N
Page
tBERASE
Block Erasing Time
(1): Refer to Application Note (12) toward the end of this document.
TYP.
200
2
200
2
MAX
1000
10
1000
3
10
UNIT
Ps
Ps
Ps
ms
NOTES
(1)
2003-01-10 5/44
5 Page 
www.DataSheet4US.ceoqmuential Read (1) Timing Diagram
CLE
TC58DVG02A1FT00
CE
WE
ALE
RE
I/O1
to I/O8
00H
RY/BY
A0 A9 A17 A25
to to to to
A7 A16 A24 A26
N N 1 N 2 527
012
Column
address
Page
address
tR
tR
NM
Page M
access
Page M 1
access
: VIH or VIL
Sequential Read (2) Timing Diagram
CLE
527
CE
WE
ALE
RE
I/O1
to I/O8
01H
RY/BY
A0 A9 A17 A25
to to to to
A7 A16 A24 A26
Column
Page
address address
NM
tR
256 256 256
N N1 N2
527
tR
012
527
Page M
access
Page M 1
access
: VIH or VIL
2003-01-10 11/44
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