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PDF NCP5212A Data sheet ( Hoja de datos )

Número de pieza NCP5212A
Descripción Single Synchronous Step-Down Controller
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NCP5212A Hoja de datos, Descripción, Manual

NCP5212Awww.DataSheet4U.com
Single Synchronous
Step-Down Controller
The NCP5212A is a synchronous stepdown controller for high
performance systems batterypower systems. The NCP5212A
includes a high efficiency PWM controller. A pin is provided to allow
two devices in interleaved operation. An internal power good voltage
monitor tracks the SMPS output. NCP5212A also features softstart
sequence, UVLO for VCC and switcher, overvoltage protection,
overcurrent protection, undervoltage protection and thermal
shutdown. The IC is packaged in QFN16
Features
0.8% accuracy 0.8 V Reference
4.5 V to 27 V Battery/Adaptor Voltage Range
Adjustable Output Voltage Range: 0.8 V to 3.3 V
Synchronization Interleaving between two NCP5212As
Skip mode for power saving operation at light load
Lossless Inductor Current Sensing
Programmable TransientResponseEnhancement (TRE) Control
Programmable Adaptive Voltage Positioning (AVP)
Input Supply Feedforward Control
Internal SoftStart
Integrated Output Discharge (SoftStop)
Buildin Adaptive Gate Drivers
PGOOD Indication
Overvoltage, Undervoltage and Overcurrent Protections
Thermal Shutdown
QFN16 Package
This is a PbFree Device
Typical Applications
Notebook Application
System Power
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1
QFN16
CASE 485AP
MARKING
DIAGRAM
16
1
N5212
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
16 15 14 13
VIN 1
VCC 2
SYN 3
EN 4
NCP5212A
12 VCCP
11 DL/TRESET
10 PGND
9 CS+
5678
QFN16
(Top View)
© Semiconductor Components Industries, LLC, 2009
May, 2009 Rev. 0
ORDERING INFORMATION
Device
Package
Shipping
NCP5212AMNTXG QFN16
(PbFree)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1 Publication Order Number:
NCP5212A/D

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NCP5212A pdf
NCP5212A
www.DataSPhINeeFt4UUN.cComTION DESCRIPTION
Pin No.
Symbol
Description
1 VIN Input voltage used for feed forward in switcher operation.
2
VCC
Supply for analog circuit
3
SYN
Synchronization interleaving use.
4 EN This pin serves as two functions. Enable: Logic control for enabling the switcher. MASTER/SLAVE:
To program the device as MASTER or SLAVE mode at dual device operation.
5
COMP
Output of the error amplifier.
6 FB Output voltage feed back.
7
IDRP/OCP
Current limit programmable and setting for AVP.
8
CS/Vo
Inductor current differential sense inverting input.
9 CS+ Inductor current differential sense noninverting input.
10
PGND
Ground reference and highcurrent return path for the bottom gate driver.
11
DL/TRESET
Gate driver output of bottom Nchannel MOSFET. It also has the function for TRE threshold setting.
12
VCCP
Supply for bottom gate driver.
13 BST Top gate driver input supply, a bootstrap capacitor connection between SWN and this pin.
14 DH Gate driver output of top Nchannel MOSFET.
15
SWN
Switch node between top MOSFET and bottom MOSFET.
16
PGOOD
Power good indicator of the output voltage. High impendence if power good (in regulation). Low im-
pendence if power not good.
17
TPAD
Copper pad on bottom of IC used for heat sinking. This pin should be connected to the analog ground
plane under the IC.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VCC Power Supply Voltage to AGND
VIN Supply to AGND
Highside Gate Drive Supply: BST to SWN
Highside Gate Drive Voltage: DH to SWN
Lowside Gate Drive Supply: VCCP to PGND
Lowside Gate Drive Voltage: DL to PGND
Input / Output Pins to AGND
Switch Node SWNPGND
VCC
VIN
VBSTVSWN,
VDHVSWN,
VCCPVPGND,
VDLVPGND,
VIO
VSWN
0.3, 6.0
0.3, 30
0.3, 6.0
V
V
V
0.3, 6.0
5 V (< 100 ns)
30 V
V
V
HighSide Gate Drive/LowSide Gate Drive Outputs
DH, DL
3(DC)
V
PGND
VPGND
0.3, 0.3
V
Thermal Characteristics
Thermal Resistance JunctiontoAmbient (QFN16 Package)
RqJA
°C/W
48
Operating Junction Temperature Range (Note 1)
TJ
40 to + 150
°C
Operating Ambient Temperature Range
TA
40 to + 85
°C
Storage Temperature Range
Tstg
55 to +150
°C
Moisture Sensitivity Level
MSL
1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
1. Internally limited by thermal shutdown, 150°C min.
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5

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NCP5212A arduino
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NCP5212A
TYPICAL OPERATING CHARACTERISTICS
Top to Bottom: EN, SWN, Vo, PGOOD
Figure 10. Powerup Sequence
Top to Bottom: EN, SWN, Vo, PGOOD
Figure 11. Powerdown Sequence
Top to Bottom: SWN_Slave, Vo_Slave, SWN_Master,
Sync_clk
Figure 12. From Unsync to Sync
Top to Bottom: SWN_Slave, Vo_Slave, SWN_Master,
Sync_clk
Figure 13. From Sync to Unsync
Top to Bottom: SWN, Vo, Io
Figure 14. Typical Transient
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