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PDF TGA2806-SM Data sheet ( Hoja de datos )
| Número de pieza | TGA2806-SM | |
| Descripción | CATV Linear Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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TGA2806-SM
CATV Linear Amplifier
Measured Performance
Small Signal Gain (75 Ω)
includes balun losses
Output TOI (75 Ω)
Key Features
• Frequency Range: 40MHz - 1GHz
• Gain: 20 dB
• 1.7 dB 75 Ω Noise Figure
• Ultra-Low Distortion: -67dBc ACPR typical
• Low DC Power Consumption
• Single Supply Bias:+8V, 380mA
• 28L Package Dimension: 5.0 x 5.0 x 0.85 mm
Primary Applications
• CMTS Equipment
• CATV Line Amplifiers
Product Description
The TriQuint TGA2806-SM is an ultra-linear,
packaged Gain Block which operates from
40MHz to 1000MHz.
The TGA2806-SM typically provides flat gain
along with ultra-low distortion. It also provides
high output power with low DC power
consumption.
This amplifier is ideally suited for use in CATV
distribution systems or other applications
requiring extremely low noise and distortion.
Demonstration Boards are available.
Lead-free and RoHS compliant.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Oct 2010 © Rev C
1
1 page  
TGA2806-SM
Typical Measured ACPR and TOI
Using Application Circuit
Vd1, Vd2 = 9 V, Id1+Id2 = 380mA typ
(includes effects of external baluns)
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Oct 2010 © Rev C
5
5 Page 
TGA2806-SM
Assembly Notes
Recommended Surface Mount Package Assembly
• Proper ESD precautions must be followed while handling packages.
• Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
• TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
• Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
• Clean the assembly with alcohol.
Reflow Profile
Ramp-up Rate
Activation Time and Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak Temperature
Ramp-down Rate
SnPb
3 °C/sec
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
240 °C
10 – 20 sec
4 – 6 °C/sec
Pb Free
3 °C/sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
260 °C
10 – 20 sec
4 – 6 °C/sec
Ordering Information
Part
TGA2806-SM, TAPE AND REEL
Package Style
5mm x 5mm QFN Surface Mount, TAPE AND REEL
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
11
Oct 2010 © Rev C
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGA2806-SM.PDF ] | |
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