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PDF SC7777T Data sheet ( Hoja de datos )

Número de pieza SC7777T
Descripción hybrid IC
Fabricantes KOA Speer Electronics 
Logotipo KOA Speer Electronics Logotipo



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No Preview Available ! SC7777T Hoja de datos, Descripción, Manual

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NEW
KA, SC
hybrid IC
EU
features
Adjustment processes are decreased
by function and ratio trimmings
High density mounting by bonding (COB)
Various types of package are available
High reliability achieved by KOA’s original thick
film technology
Thick film printed circuit substrate applies the non-noble
metal paste (conductive paste and resistive paste) and
receives the many total inquires including material
selecting, pattern designing and mass production
NoErWdering information
New Part #
KA
7777
Product
Code
KA: Hybrid IC
SC: Non-Noble
KOA Ref.
Number
D
Terminal Surface
Material
D: SnAgCu
T: Sn
Component - KA/CB Series
Substrate Materials
Conductors, Resistors
Mounting
Package, Outside Terminals
Over Coating, Plating
Item
AI2O3 Alumina
Glass epoxy
Item
Conductor resistance
Heat shock
RuO2
Item
COB
BGA
QFP
Chip
Package
SIP
DIP, SOP
ZIP
Over Coating
Epoxy metamorphic phenol
Epoxy
o= Available x= Not available
Printing
Mounting
oo
xo
Ag-Pd
Ag-Pt
18m/ /15µmµ
5m/ /10µm
-55°C~+125°C 300 Cycles -55°C~+125°C 500 Cycles
5~10M±100x10-6/K
Specifications
Au Wire, AI Wire
0.8mm Pitch~
0.4mm Pitch~
0.6mm x 0.3mm (0.4mm x 0.2mm)~
Lead Pitch
1.8mm, 2.0mm, 2.5mm, 2.54mm
1.27mm, 1.8mm, 2.54mm
2.54mm
Color
Black
Black
Bonding
o
o
Cu
2m/ /20µm
-55°C~+125°C 500 Cycles
10~1M±100x10-6/k
UL Standard
94 V0 Approved
94 V1 Approved
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1/08/09
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
249

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