|
|
PDF EMIF04-EAR01F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF04-EAR01F2 | |
| Descripción | EMI filter and ESD protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de EMIF04-EAR01F2 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
|
No Preview Available !
www.datasheet4u.com
EMIF04-EAR01F2
4-line IPAD™, EMI filter and ESD protection
Features
■ EMI (I/O) low-pass filter
■ High efficiency in EMI filtering
■ High density capacitor
■ Very low PCB space occupation:
1.92 x 1.42 mm²
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression on external
pins (IEC 61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 Level 4, on output pins
– 15 kV (air discharge)
■ IEC 61000-4-2 Level 1, on input pins
– 2 kV (air discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ Earpiece and headset for mobile phones
■ PDAs
■ MP3 players
Description
The EMIF04-EAR01F2 is a 4-line highly
integrated device designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference. The EMIF04 Flip Chip packaging
means the package size is equal to the die size.
This filter includes ESD protection circuitry, which
prevents damage to the application when
subjected to ESD surges up 15 kV.
Flip Chip
(11 bumps)
Figure 1. Pin configuration (bump side)
123
I1 GND O1 A
I2 O2 B
I3 GND O3 C
I4 GND O4 D
Figure 2. Schematic
R
I1
C
R
I2
C
R
I3
C
R
I4
C
O1
O2
O3
04
GND = A2, C2, D2
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 2
1/7
www.st.com
7
1 page  
EMIF04-EAR01F2
Figure 10. Footprint recommendations
www.datasheet4u.com Copper pad Diameter
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
Packaging information
Figure 11. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(Y = year
ww = week)
E
xxz
y ww
Figure 12. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.56
0.73 ± 0.05
All dimensions in mm
4 ± 0.1
User direction of unreeling
Note:
Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF04-EAR01F2.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| EMIF04-EAR01F2 | EMI filter and ESD protection | STMicroelectronics |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |