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PDF S71GL064N Data sheet ( Hoja de datos )

Número de pieza S71GL064N
Descripción Stacked Multi-Chip Product (MCP) Flash Memory and RAM
Fabricantes SPANSION 
Logotipo SPANSION Logotipo



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No Preview Available ! S71GL064N Hoja de datos, Descripción, Manual

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S71GL-N Based MCPs
Stacked Multi-Chip Product (MCP)
Flash Memory and RAM
64/32 Megabit (4/2 M x 16-bit) CMOS 3.0 Volt-only
Page Mode Flash Memory and
32/16/8/4 Megabit (2M/1M/512k/256k x 16-bit) Pseudo Static RAM
Data Sheet (Advance Information)
S71GL-N Based MCPs Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S71GL-N_00
Revision 02
Issue Date June 19, 2007

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S71GL064N pdf
Data Sheet (Advance Information)
2. MCP Block Diagram
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CE1#f
WP#/ACC
RESET#
Flash-only Address
Shared Address
OE#
WE#
VCCf
VCC
Flash
VSS
RY/BY#
CE1#s
UB#
LB#
CE2s
VCCS
VCC
pSRAM
IO15-IO0
CE#
UB#
LB#
DQ15 to DQ0
June 19, 2007 S71GL-N_00_02
S71GL-N Based MCPs
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S71GL064N arduino
Data Sheet (Advance Information)
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2007 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse, ORNAND, HD-SIMand
combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only
and may be trademarks of their respective owners.
June 19, 2007 S71GL-N_00_02
S71GL-N Based MCPs
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