DataSheet.es    


PDF TCLAMP3302N Data sheet ( Hoja de datos )

Número de pieza TCLAMP3302N
Descripción Low Capacitance TVS
Fabricantes Semtech Corporation 
Logotipo Semtech Corporation Logotipo



Hay una vista previa y un enlace de descarga de TCLAMP3302N (archivo pdf) en la parte inferior de esta página.


Total 9 Páginas

No Preview Available ! TCLAMP3302N Hoja de datos, Descripción, Manual

www.datasheet4u.com
TClamp3302N
Low Capacitance TVS
for Ethernet and Telecom Interfaces
PROTECTION PRODUCTS - TransClampΤΜ
Description
A TransClampΤΜ is a low capacitance TVS array designed
to protect high speed data interfaces. This series has
been specifically designed to protect sensitive compo-
nents which are connected to data and transmission
lines from overvoltage caused by ESD (electrostatic
discharge), CDE (Cable Discharge Events), and Light-
ning.
These devices integrate low capacitance, surge-rated
compensation diodes with a high power transient
voltage suppressor (TVS). The compensation diodes
are arranged in a bridge pattern allowing the device to
be connected in common mode and/or differential
mode. This allows the designer maximum flexibility and
reduces parts count. The capacitance of the device is
limited to 12pF maximum from line-to-line to ensure
correct signal transmission on high-speed lines.
These devices may be used to meet Telcordia GR-1089-
CORE short-haul (intra-building) surge requirements and
will withstand a minimum 100 A surge for a 2/10µs
pulse.
The TClampTM3302N is in a 10-pin, RoHS/WEEE compli-
ant, SLP2626P10 package. It measures 2.6 x 2.6 x
0.60mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. They are
particularly well suited for applications where board
space is at a premium such as integrated connectors/
magnetics and carrier class Ethernet equipment.
Features
‹ Transient protection for high-speed data lines to
Bellcore 1089 (Intra-Building) 100A (2/10µs)
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) L5, 95A (8/20µs)
‹ Low capacitance (12pF line-to-line)
‹ Low operating voltages (3.3V)
‹ Low clamping voltage
‹ Small SLP Package saves board space
‹ Solid-state technology
Mechanical Characteristics
‹ SLP2626P10 10L package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 2.6 x 2.6 x 0.60 mm
‹ Lead Pitch: 0.5mm
‹ Molding compound flammability rating: UL 94V-0
‹ Marking: Marking Code
‹ Packaging: Tape and Reel
Applications
‹ 10/100/1000 Ethernet
‹ T3/E3
‹ Integrated Magnetics
‹ Carrier Class Equipment
‹ Customer Premise Equipment
Circuit Diagram
LINE 1
(1, 2, 3)
Center Tab
LINE 2
(8, 9, 10)
Revision 01/17/2008
Package Configuration
2.60
1 2 CL
CL 2.60
0.50 BSC
0.60
10 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com

1 page




TCLAMP3302N pdf
www.datasheet4u.com
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Two
High-Speed Data Lines
These devices are designed to protect two high-speed
data lines (one differential pair) from transient over-
voltages which result from lightning and ESD. They can
be configured to protect in differential (Line-to-Line)
and common (Line-to-Ground) mode. Data line inputs/
outputs are connected at pins 1, 2 and 3, and 8, 9
and 10 as shown. For proper operation, pins 1 - 3
must be connected together and pins 8 - 10 must be
connected together. Pins 4, 5, 6, and 7 may be left
unconnected. For differential operation, the center tab is
also left not connected. For common mode operation,
the center tab is connected to ground. The ground
connection should be made directly to a ground plane
on the board for best results. The use of multiple vias
is recommended for reduced ground loop inductance.
Short-Haul/Intrabuilding Immunity Requirements for
Ethernet-based Systems
The accelerating demand for bandwidth-hungry
services such as Voice over IP, Metropolitan Area
Networks (MAN), Ethernet over telecommunications
backplanes, and broadband to the home are driving
the deployment of high-reliability carrier and enterprise
class Ethernet-based systems. These systems require
the robust protection of external ports from transient
voltage events such as lightning, electrostatic
discharge, and cable discharge events. Each new
generation of Ethernet deployment yields higher-
density boards that demand protection solutions that
occupy less board space.
The Telcordia Technologies (Bellcore) GR-1089-CORE
specification defines a set of requirements for lightning
and AC power cross immunity for intrabuilding equip-
ment. The lightning tests are applied as metallic (line-
to-line) or longitudinal (line-to-ground) waveforms. The
waveforms are defined with a rise time of 2µs and a
decay time of 10µs with a short circuit current of
100A. One surge of positive and one of negative
polarity are applied. To pass the test, the equipment
must continue to operate after the test. If a 2/10µs
generator is unavailable, then a 8/20µs waveform may
be applied with additional series resistance (6metal-
lic, 12longitudinal).
TClamp3302N
Circuit Diagram
LINE 1
(1, 2, 3)
Center Tab
LINE 2
(8, 9, 10)
Pin Configuration (Top Side View)
1
2
3 GND
4
5
10
9
8
7
6
Pin
1, 2, 3
8, 9, 10
4, 5, 6, 7
Center Tab
Identification
Line 1 in/out
Line 2 in/out
No Connect
Ground
2008 Semtech Corp.
5
www.semtech.com

5 Page










PáginasTotal 9 Páginas
PDF Descargar[ Datasheet TCLAMP3302N.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
TCLAMP3302NLow Capacitance TVSSemtech Corporation
Semtech Corporation

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar