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PDF DB-2933-54 Data sheet ( Hoja de datos )

Número de pieza DB-2933-54
Descripción RF POWER amplifier using 2 x SD2933 N-Channel enhancement-mode lateral MOSFETs
Fabricantes STMicroelectronics 
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DB-2933-54
RF POWER amplifier using 2 x SD2933
N-Channel enhancement-mode lateral MOSFETs
General feature
Excellent thermal stability
Frequency: 1.6 - 54MHz
Supply voltage: 48V
Output power: 400W typ.
Input power 10W max.
Efficiency: 57% - 76%
IMD at 300WPEP < -26dBc
Load mismatch: 3:1all phases
Description
The DB-2933-54 is a RF broadband power
amplifier intended for linear or nonlinear operation
over the band 1.6 to 54 MHz using 2x SD2933
gold metallized N-channel MOS field-effect
transistors. The temperature compensating
biasing circuit supports class B and class AB
operation.
DB-2933-54 is designed in cooperation with
Specific RF Devices.
Order Code
DB-2933-54
October 2006
Rev 1
1/13
www.st.com
13

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DB-2933-54 pdf
DB-2933-54
www.DataSheet4U.com
3 Typical performance
Typical performance
Figure 1. Output power & efficiency
vs frequency
60 100
59
58
- eff
- Pout
57
90
80
70
56 60
55 50
54 40
53 30
52
V dd = 40V
20
Id q = 2 x 9 0 m A
51
Pin = 1 0 W
10
50 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65
Fre que nc y (M Hz)
Figure 2. Output power & efficiency
vs frequency
60 100
-5 9
eff
-5 8 Pout
57
90
80
70
56 60
55 50
54 40
53 30
52
V dd = 48V
20
Id q = 2 x 9 0 0 m A
51
Pin = 1 0 W
10
50 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65
Fre que ncy (M Hz)
Figure 3. IMD vs frequency
0
-5
Vdd = 48V
Id q = 2 x 9 0 0 m A
-1 0 Pout = 300 W PEP
-15
-20
-25
Figure 4. Output power vs drain voltage
600
5 0 0 Pin = 1 0 W
Id q = 2 x 9 0 0 m A
400
300
200
-30 1 00
-35
-40
0
IM D
5 10 15 20 25 30 35 40 45 50 55 60 65
Fre que ncy (M H z)
0
10 14 18 22 26 30 34 38 42 46 50
Dr ain vo ltag e (V )
1.6 M H z
2 8 M Hz
5 M Hz
4 0 M Hz
10 M H z
6 0 M Hz
2 0 M Hz
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DB-2933-54 arduino
DB-2933-54
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7 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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