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PDF RMDA20420 Data sheet ( Hoja de datos )

Número de pieza RMDA20420
Descripción 20-42 GHz Broadband Driver Amplifier
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! RMDA20420 Hoja de datos, Descripción, Manual

October 2004
RMDA20420
20–42 GHz Broadband Driver Amplifier
General Description
The Fairchild Semiconductor's RMDA20420 is a
broadband driver amplifier designed for use in point to point
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radio, point to multi-point communications, LMDS, SatCom
and various communication applications. The RMDA20420
is a fully matched GaAs MMIC utilizing our advanced
0.15µm gate length PHEMT process.
Features
• Wideband 20–42GHz operation
• 22dB small signal gain (typ.)
• 23dBm saturated power output (typ.)
• Matched to 50
• Optional bonding configuration for multiplier applications
• Chip Size 1.720mm x 0.760mm
Device
Absolute Ratings
Symbol
Vd
Vg
Vdg
Id
Pin
Tc
TSTG
RJC
Parameter
Positive DC Voltage (+3.5V Typical)
Negative DC Voltage
Simultaneous (Vd - Vg)
Positive DC Current
RF Input Power (from 50source)
Operating Baseplate Temperature
Storage Temperature Range
Thermal Resistance (Channel to Backside)
Ratings
+5
-2
+7
600
15
-40 to +85
-55 to +125
57
Units
V
V
V
mA
dBm
°C
°C
°C/W
©2004 Fairchild Semiconductor Corporation
RMDA20420 Rev. D

1 page




RMDA20420 pdf
Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE
Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal
conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with
gold over nickel and should be capable of withstanding 325°C for 15 minutes.
Die attachment for power devices should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen
environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC Ground.
These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of
bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of
wrist-grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges
through the device.
www.DataSheet4U.com Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for
appropriate stress relief. The RF input and output bonds should be typically 0.012" long corresponding to a typical 2 mil gap
between the chip and the substrate material.
©2004 Fairchild Semiconductor Corporation
RMDA20420 Rev. D

5 Page





RMDA20420 arduino
20
15
10
21GHz
5
3xFo
30GHz
Conversion
Gain=0
39GHz
0
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-5
-10
2xFo
-15
1xFo
-20
2 0 2 2 2 4 2 6 2 8 30 32 34 36 38 40
Tripled Frequency (GHz)
Figure 9. Measured Tripler Performance.
©2004 Fairchild Semiconductor Corporation
RMDA20420 Rev. D

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