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PDF FMA219 Data sheet ( Hoja de datos )
| Número de pieza | FMA219 | |
| Descripción | X-BAND LNA MMIC | |
| Fabricantes | Filtronic Compound Semiconductors | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de FMA219 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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X-BAND LNA MMIC
FEATURES:
• 7.0 – 11.0 GHz Operating Bandwidth
• 1.1 dB Noise Figure
• 21 dB Small-Signal Gain
• 12 dBm Output Power
• +3V Single Bias Supply
• DC De-coupled Input and Output Ports
www.DataSheet4U.cGomENERAL DESCRIPTION:
The FMA219 is a 2-stage, reactively matched
pHEMT low-noise MMIC amplifier designed for
use over 7.0 to 11.0 GHz. The amplifier
requires a single +3V supply and one off-chip
component for supply de-coupling. Both the
input and output ports are DC de-coupled.
Grounding of the amplifier is provided by
plated thru-vias to the bottom of the die, no
additional ground is required. The amplifier is
unconditionally stable over all load states (-45
to +85°C), and conditionally stable if the input
port is open-circuited.
LAYOUT:
FMA219
Datasheet v3.0
TYPICAL APPLICATIONS:
• Low noise front end amplifiers
• General X-Band gain block
ELECTRICAL SPECIFICATIONS:
PARAMETER
SYMBOL
Operating Frequency Bandwidth
BW
Small Signal Gain
S21
Operating Current
Small Signal Gain Flatness
Noise Figure
IOP
∆S21
NF
3rd Order Intermodulation Distortion
IMD
Power at 1dB Compression
Input Return Loss
Input Return Loss @ 9.5GHz + 10GHz
Output Return Loss
Reverse Isolation
Note: TAMBIENT = 22°C
P1dB
S11
S11(9.5+10GHz)
S22
S12
CONDITIONS
VDD = +3 V IDD = IOP
VDD = +3 V IDD = IOP
No RF input
VDD = +3 V IDD = IOP
VDD = +3 V, IDD = IOP
VDD = +3 V, IDD = IOP
POUT = +1.5 dBm SCL
VDD = +3 V
VDD = +3 V IDD = IOP
VDD = +3 V IDD = IOP
VDD = +3 V IDD = IOP
VDD = +3 V IDD = IOP
MIN
7
19
50
11.5
TYP
21
65
±0.5
1.1
MAX
11
23
UNITS
GHz
dB
80
±0.8
1.4
mA
dB
-47
12.5
-7
-16
-40
-3
-4
-10
-30
dBc
dBm
dB
dB
dB
dB
Tel: +44 (0) 1325 301111
1
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
1 page  
RECOMMENDED ASSEMBLY SCHEMATIC:
75µm nominal gap on
each side
FMA219
Datasheet v3.0
Input and output thin film
substrates with 50Ω microstrip
transmission lines. Substrate
thickness 250µm or thinner is
recommended.
www.DataSheet4U.com
25µm dia. Au wire (x2) on
input and output ports, less
than 1000µm length each
150pF
capacitor
Note: The supply de-coupling
capacitor (150 pF recommended
value) should be placed as close
to the MMIC as practical.
250µm Au ribbon
To +VDD recommended
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of conductive epoxy following the
manufacturer’s
recommended
curing
temperature. For eutectic 80/20 gold/tin
solder, use a stage temperature of 280-300°C
for a maximum time of 60s. Use forming gas
(90%N2, 10% H2) for best results.
Recommended lead bond technique is
thermocompression wedge bonding with 25µm
diameter wire. The bond tool force shall be
35-38g. Bonding stage temperature shall be
230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not
recommended.
should be observed at all stages of storage,
handling, assembly, and testing. These
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MIL-
HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters are available on request
DISCLAIMERS:
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
ORDERING INFORMATION:
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions
5
PART NUMBER
FMA219
DESCRIPTION
Die
Tel: +44 (0) 1325 301111
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Email: [email protected]
Website: www.filtronic.com
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet FMA219.PDF ] | |
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