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PDF 1117CD-1.8 Data sheet ( Hoja de datos )
| Número de pieza | 1117CD-1.8 | |
| Descripción | AMS1117CD-1.8 | |
| Fabricantes | Advanced Monolithic Systems | |
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Hay una vista previa y un enlace de descarga de 1117CD-1.8 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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Advanced
Monolithic
Systems
FEATURES
• Three Terminal Adjustable or Fixed Voltages*
1.5V, 1.8V, 2.5V, 2.85V, 3.3V and 5.0V
• Output Current of 1A
• Operates Down to 1V Dropout
www.DataShe•etL4Uin.ceomRegulation: 0.2% Max.
• Load Regulation: 0.4% Max.
• SOT-223, TO-252 and SO-8 package available
AMS1117
1A LOW DROPOUT VOLTAGE REGULATOR
RoHS compliant
APPLICATIONS
• High Efficiency Linear Regulators
• Post Regulators for Switching Supplies
• 5V to 3.3V Linear Regulator
• Battery Chargers
• Active SCSI Terminators
• Power Management for Notebook
• Battery Powered Instrumentation
GENERAL DESCRIPTION
The AMS1117 series of adjustable and fixed voltage regulators are designed to provide 1A output current and to operate
down to 1V input-to-output differential. The dropout voltage of the device is guaranteed maximum 1.3V at maximum output
current, decreasing at lower load currents.
On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress under overload
conditions on both the regulator and power source circuitry.
The AMS1117 devices are pin compatible with other three-terminal SCSI regulators and are offered in the low profile surface
mount SOT-223 package, in the 8L SOIC package and in the TO-252 (DPAK) plastic package.
ORDERING INFORMATION:
PACKAGE TYPE
OPERATING JUNCTION
TO-252
SOT-223
8L SOIC
TEMPERATURE RANGE
AMS1117CD
AMS1117
AMS1117CS
AMS1117CD-1.5 AMS1117-1.5 AMS1117CS-1.5
AMS1117CD-1.8 AMS1117-1.8
AMS1117CS-1.8
AMS1117CD-2.5 AMS1117-2.5
AMS1117CS-2.5
AMS1117CD-2.85 AMS1117-2.85 AMS1117CS-2.85
AMS1117CD-3.3 AMS1117-3.3
AMS1117CS-3.3
AMS1117CD-5.0 AMS1117-5.0
AMS1117CS-5.0
*For additional available fixed voltages contact factory.
-40 to 125° C
-40 to 125° C
-40 to 125° C
-40 to 125° C
-40 to 125° C
-40 to 125° C
-40 to 125° C
PIN CONNECTIONS
SOT-223 Top View
3 PIN FIXED/ADJUSTABLE
VERSION
1- Ground/Adjust
2- VOUT
3- VIN
123
8L SOIC Top View
GND/ADJ 1
VOUT
VOUT
VIN
2
3
4
8 N/C
7 VOUT
6 VOUT
5 N/C
TO-252 FRONT VIEW
TAB IS
OUTPUT
3
2
1
Advanced Monolithic Systems, Inc. www.advanced-monolithic.com Phone (925) 443-0722 Fax (925) 443-0723
1 page  
APPLICATION HINTS
Connected as shown , RP is not multiplied by the divider ratio
RP
PARASITIC
AMS1117
LINE RESISTANCE
VIN IN OUT
ADJ
R1* RL
www.DataSheet4U.com
R2*
*CONNECT R1 TO CASE
CONNECT R2 TO LOAD
Figure 3. Connections for Best Load Regulation
In the case of fixed voltage devices the top of R1 is connected
Kelvin internally, and the ground pin can be used for negative side
sensing.
Thermal Considerations
The AMS1117 series have internal power and thermal limiting
circuitry designed to protect the device under overload conditions.
However maximum junction temperature ratings of 125°C should
not be exceeded under continuous normal load conditions.
Careful consideration must be given to all sources of thermal
resistance from junction to ambient. For the surface mount
package SOT-223 additional heat sources mounted near the device
must be considered. The heat dissipation capability of the PC
board and its copper traces is used as a heat sink for the device.
The thermal resistance from the junction to the tab for the
AMS1117 is 15°C/W. Thermal resistance from tab to ambient can
be as low as 30°C/W.
AMS1117
The total thermal resistance from junction to ambient can be as
low as 45°C/W. This requires a reasonable sized PC board with at
least on layer of copper to spread the heat across the board and
couple it into the surrounding air.
Experiments have shown that the heat spreading copper layer does
not need to be electrically connected to the tab of the device. The
PC material can be very effective at transmitting heat between the
pad area, attached to the pad of the device, and a ground plane
layer either inside or on the opposite side of the board. Although
the actual thermal resistance of the PC material is high, the
Length/Area ratio of the thermal resistance between layers is
small. The data in Table 1, was taken using 1/16” FR-4 board with
1 oz. copper foil, and it can be used as a rough guideline for
estimating thermal resistance.
For each application the thermal resistance will be affected by
thermal interactions with other components on the board. To
determine the actual value some experimentation will be
necessary.
The power dissipation of the AMS1117 is equal to:
PD = ( VIN - VOUT )( IOUT )
Maximum junction temperature will be equal to:
TJ = TA(MAX) + PD(Thermal Resistance (junction-to-ambient))
Maximum junction temperature must not exceed 125°C.
Ripple Rejection
The ripple rejection values are measured with the adjustment pin
bypassed. The impedance of the adjust pin capacitor at the ripple
frequency should be less than the value of R1 (normally 100Ω to
200Ω) for a proper bypassing and ripple rejection approaching the
values shown. The size of the required adjust pin capacitor is a
function of the input ripple frequency. If R1=100Ω at 120Hz the
adjust pin capacitor should be >13µF. At 10kHz only 0.16µF is
needed.
The ripple rejection will be a function of output voltage, in
circuits without an adjust pin bypass capacitor. The output ripple
will increase directly as a ratio of the output voltage to the
reference voltage (VOUT / VREF ).
Table 1.
COPPER AREA
TOP SIDE* BACK SIDE
BOARD AREA
2500 Sq. mm 2500 Sq. mm
2500 Sq. mm
1000 Sq. mm 2500 Sq. mm
2500 Sq. mm
225 Sq. mm 2500 Sq. mm
2500 Sq. mm
100 Sq. mm 2500 Sq. mm
2500 Sq. mm
1000 Sq. mm 1000 Sq. mm
1000 Sq. mm
1000 Sq. mm
0
1000 Sq. mm
* Tab of device attached to topside copper.
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
45°C/W
45°C/W
53°C/W
59°C/W
52°C/W
55°C/W
Advanced Monolithic Systems, Inc. www.advanced-monolithic.com Phone (925) 443-0722 Fax (925) 443-0723
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet 1117CD-1.8.PDF ] | |
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