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PDF LH28F800BG-L Data sheet ( Hoja de datos )

Número de pieza LH28F800BG-L
Descripción 8 M-bit (512 kB x 16) SmartVoltage Flash Memory
Fabricantes Sharp Electrionic Components 
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LH28F800BG-L/BGH-L (FOR TSOP, CSP)
LH28F800BG-L/BGH-L 8 M-bit (512 kB x 16) SmartVoltage
Flash Memories
(FOR TSOP, CSP)
DESCRIPTION
The LH28F800BG-L/BGH-L flash memories with
SmartVoltage technology are high-density, low-cost,
nonvolatile, read/write storage solution for a wide
range of applications. The LH28F800BG-L/BGH-L
can operate at VCC = 2.7 V and VPP = 2.7 V. Their
low voltage operation capability realizes longer
battery life and suits for cellular phone application.
Their boot, parameter and main-blocked
architecture, flexible voltage and enhanced cycling
capability provide for highly flexible component
suitable for portable terminals and personal
computers. Their enhanced suspend capabilities
provide for an ideal solution for code + data storage
applications. For secure code storage applications,
such as networking, where code is either directly
executed out of flash or downloaded to DRAM, the
LH28F800BG-L/BGH-L offer two levels of protection
: absolute protection with VPP at GND, selective
hardware boot block locking. These alternatives
give designers ultimate control of their code security
needs.
FEATURES
• SmartVoltage technology
– 2.7 V, 3.3 V or 5 V VCC
– 2.7 V, 3.3 V, 5 V or 12 V VPP
• High performance read access time
LH28F800BG-L85/BGH-L85
– 85 ns (5.0±0.25 V)/90 ns (5.0±0.5 V)/
100 ns (3.3±0.3 V)/120 ns (2.7 to 3.6 V)
LH28F800BG-L12/BGH-L12
– 120 ns (5.0±0.5 V)/130 ns (3.3±0.3 V)/
150 ns (2.7 to 3.6 V)
• Enhanced automated suspend options
– Word write suspend to read
– Block erase suspend to word write
– Block erase suspend to read
• Enhanced data protection features
– Absolute protection with VPP = GND
– Block erase/word write lockout during power
transitions
– Boot blocks protection with WP# = VIL
• SRAM-compatible write interface
• Optimized array blocking architecture
– Two 4 k-word boot blocks
– Six 4 k-word parameter blocks
– Fifteen 32 k-word main blocks
– Top or bottom boot location
• Enhanced cycling capability
– 100 000 block erase cycles
• Low power management
– Deep power-down mode
– Automatic power saving mode decreases ICC
in static mode
• Automated word write and block erase
– Command user interface
– Status register
• ETOXTMV nonvolatile flash technology
• Packages
– 48-pin TSOP Type I (TSOP048-P-1220)
Normal bend/Reverse bend
– 48-ball CSP (FBGA048-P-0808)
ETOX is a trademark of Intel Corporation.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books,
etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
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LH28F800BG-L pdf
1 INTRODUCTION
This datasheet contains LH28F800BG-L/BGH-L
specifications. Section 1 provides a flash memory
overview. Sections 2, 3, 4 and 5 describe the
memory organization and functionality. Section 6
covers electrical specifications. LH28F800BG-L/
BGH-L flash memories documentation also includes
ordering information which is referenced in
Section 7.
1.1 New Features
Key enhancements of LH28F800BG-L/BGH-L
SmartVoltage flash memories are :
• SmartVoltage Technology
• Enhanced Suspend Capabilities
• Boot Block Architecture
Note following important differences :
• VPPLK has been lowered to 1.5 V to support
2.7 V, 3.3 V and 5 V block erase and word
write operations. Designs that switch VPP off
during read operations should make sure that
the VPP voltage transitions to GND.
• To take advantage of SmartVoltage technology,
allow VPP connection to 2.7 V, 3.3 V or 5 V.
1.2 Product Overview
The LH28F800BG-L/BGH-L are high-performance
8 M-bit SmartVoltage flash memories organized as
512 k-word of 16 bits. The 512 k-word of data is
arranged in two 4 k-word boot blocks, six 4 k-word
parameter blocks and fifteen 32 k-word main blocks
which are individually erasable in-system. The
memory map is shown in Fig. 1.
SmartVoltage technology provides a choice of VCC
and VPP combinations, as shown in Table 1, to
meet system performance and power expectations.
2.7 V VCC consumes approximately one-fifth the
power of 5 V VCC and 3.3 V VCC consumes
approximately one-fourth the power of 5 V VCC.
LH28F800BG-L/BGH-L (FOR TSOP, CSP)
But, 5 V VCC provides the highest read
performance. VPP at 2.7 V, 3.3 V and 5 V
eliminates the need for a separate 12 V converter,
while VPP = 12 V maximizes block erase and word
write performance. In addition to flexible erase and
program voltages, the dedicated VPP pin gives
complete data protection when VPP VPPLK.
Table 1 VCC and VPP Voltage Combinations
Offered by SmartVoltage Technology
VCC VOLTAGE
2.7 V
3.3 V
5V
VPP VOLTAGE
2.7 V, 3.3 V, 5 V, 12 V
3.3 V, 5 V, 12 V
5 V, 12 V
Internal VCC and VPP detection circuitry auto-
matically configures the device for optimized read
and write operations.
A Command User Interface (CUI) serves as the
interface between the system processor and
internal operation of the device. A valid command
sequence written to the CUI initiates device
automation. An internal Write State Machine (WSM)
automatically executes the algorithms and timings
necessary for block erase and word write
operations.
A block erase operation erases one of the device’s
32 k-word blocks typically within 0.39 second (5 V
VCC, 12 V VPP), 4 k-word blocks typically within
0.25 second (5 V VCC, 12 V VPP) independent of
other blocks. Each block can be independently
erased 100 000 times. Block erase suspend mode
allows system software to suspend block erase to
read data from, or write data to any other block.
Writing memory data is performed in word
increments of the device’s 32 k-word blocks
typically within 8.4 µs (5 V VCC, 12 V VPP), 4 k-
word blocks typically within 17 µs (5 V VCC, 12 V
VPP). Word write suspend mode enables the
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LH28F800BG-L arduino
LH28F800BG-L/BGH-L (FOR TSOP, CSP)
COMMAND
Table 3 Command Definitions (NOTE 7)
BUS CYCLES
FIRST BUS CYCLE
SECOND BUS CYCLE
REQD.
NOTE Oper (NOTE 1) Addr (NOTE 2) Data (NOTE 3) Oper (NOTE 1) Addr (NOTE 2) Data (NOTE 3)
Read Array/Reset
1
Write X FFH
Read Identifier Codes
2
4 Write
X
90H Read
IA
ID
Read Status Register
2
Write
X
70H Read
X
SRD
Clear Status Register
1
Write
X
50H
Block Erase
2
5 Write
BA
20H Write
BA
D0H
Word Write
2
5, 6 Write
WA 40H or 10H Write
WA
WD
Block Erase and
Word Write Suspend
1 5 Write X B0H
Block Erase and
Word Write Resume
1 5 Write X D0H
NOTES :
1. Bus operations are defined in Table 2.
2. X = Any valid address within the device.
IA = Identifier code address : see Fig. 2.
BA = Address within the block being erased.
WA = Address of memory location to be written.
3. SRD = Data read from status register. See Table 6 for a
description of the status register bits.
WD = Data to be written at location WA. Data is latched
on the rising edge of WE# or CE# (whichever
goes high first).
ID = Data read from identifier codes.
4. Following the Read Identifier Codes command, read
operations access manufacture and device codes. See
Section 4.2 for read identifier code data.
5. If the block is boot block, WP# must be at VIH or RP#
must be at VHH to enable block erase or word write
operations. Attempts to issue a block erase or word write
to a boot block while WP# is VIH or RP# is VIH.
6. Either 40H or 10H is recognized by the WSM as the
word write setup.
7. Commands other than those shown above are reserved
by SHARP for future device implementations and should
not be used.
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