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PDF NT40N03R Data sheet ( Hoja de datos )
| Número de pieza | NT40N03R | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTD40N03R
Power MOSFET
45 Amps, 25 Volts
N−Channel DPAK
Features
• Planar HD3e Process for Fast Switching Performance
• Low RDS(on) to Minimize Conduction Loss
• Low Ciss to Minimize Driver Loss
• Low Gate Charge
• Optimized for High Side Switching Requirements in
High−Efficiency DC−DC Converters
• Pb−Free Packages are Available
www.DataShMeeAtX4IUM.UcMomRATINGS (TJ = 25°C unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance − Junction−to−Case
Total Power Dissipation @ TC = 25°C
Drain Current
− Continuous @ TC = 25°C, Chip
− Continuous @ TA = 25°C, Limited by Wires
− Single Pulse (tp ≤ 10 ms)
Thermal Resistance − Junction−to−Ambient
(Note 1)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C
Thermal Resistance − Junction−to−Ambient
(Note 2)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C
Operating and Storage Temperature Range
VDSS
VGS
RqJC
PD
ID
ID
ID
RqJA
PD
ID
RqJA
PD
ID
TJ, Tstg
25 Vdc
±20 Vdc
3.0 °C/W
50 W
45 A
32 A
100 A
71.4 °C/W
2.1 W
9.2 A
100 °C/W
1.5
7.8
−55 to
175
W
A
°C
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
TL 260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq. in pad size.
2. When surface mounted to an FR4 board using minimum recommended
pad size.
http://onsemi.com
45 AMPERES, 25 VOLTS
RDS(on) = 12.6 mW (Typ)
N−CHANNEL
D
G
S
4
4
12
3
CASE 369AA
DPAK
(Surface Mount)
STYLE 2
1
2
3
CASE 369D
DPAK
(Straight Lead)
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENTS
4 Drain
4 Drain
1
Gate
2
Drain
3
Source
1
Gate
2
Drain
3
Source
40N03= Device Code
Y = Year
WW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 5
1
Publication Order Number:
NTD40N03R/D
1 page  
1.0
D = 0.5
0.2
0.1
0.1 0.05
0.02
0.01
SINGLE PULSE
0.01
0.00001
0.0001
www.DataSheet4U.com
NTD40N03R
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
0.001
0.01
t, TIME (s)
Figure 12. Thermal Response
0.1
RqJC(t) = r(t) RqJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TC = P(pk) RqJC(t)
1 10
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5
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| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet NT40N03R.PDF ] | |
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