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PDF 10EL11 Data sheet ( Hoja de datos )
| Número de pieza | 10EL11 | |
| Descripción | MC10EL11 | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC10EL11, MC100EL11
5.0 V ECL 1:2 Differential
Fanout Buffer
The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device
is functionally similar to the E111 device but with higher performance
capabilities. The within-device skew and propagation delay is
significantly improved over the E111.
The differential inputs of the EL11 employ clamping circuitry to
maintain stability under open input conditions. If the inputs are left open
(pulled to VEE) the Q outputs will go LOW.
w w w . D a t a S h e Te ht 4eU10. c0oSmeries contains temperature compensation.
Features
• 265 ps Propagation Delay
• 5 ps Skew Between Outputs
• PECL Mode Operating Range: VCC = 4.2 V to 5.7 with VEE = 0 V
• NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V
• Internal Input Pulldown Resistors
• Pb−Free Packages are Available
Q0 1
8 VCC
http://onsemi.com
8
1
SOIC−8
D SUFFIX
CASE 751
8
1
TSSOP−8
DT SUFFIX
CASE 948R
MARKING
DIAGRAMS*
8
HEL11
ALYW
G
1
8
KEL11
ALYW
G
1
8
HL11
ALYWG
G
1
8
KL11
ALYWG
G
1
Q0 2
Q1 3
7D
6D
Q1 4
5 VEE
Figure 1. Logic Diagram and Pinout Assignment
Table 1. PIN DESCRIPTION
PIN FUNCTION
D, D
Q0, Q0; Q1, Q1
VCC
VEE
EP
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
DFN8
MN SUFFIX
CASE 506AA
14
14
H = MC10
K = MC100
4Q = MC10
2E = MC100
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
December, 2006− Rev. 9
1
Publication Order Number:
MC10EL11/D
1 page  
MC10EL11, MC100EL11
Table 8. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −5.0 V (Note 14)
Symbol
Characteristic
−40°C
Min Typ Max
25°C
Min Typ Max
85°C
Min Typ Max
Unit
fmax
tPLH
tPHL
tSKEW
Maximum Toggle Frequency
Propagation Delay to Output
Within-Device Skew (Note 15)
Duty Cycle Skew (Note 16)
1.5 GHz
135 260 385 190 265 340 215 29*0 365 ps
5
5 20
5 20 ps
5
5 20
5 20
tJITTER
VPP
tr
tf
Random Clock Jitter (RMS)
Input Swing (Note 17)
Output Rise/Fall Times Q
(20% − 80%)
0.6 ps
150 1000 150 1000 150 1000 mV
100 225 350 100 225 350 100 225 350 ps
www.DataSheet4NUO.cToEm: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
14. 10 Series: VEE can vary +0.25 V / −0.5 V.
100 Series: VEE can vary +0.8 V / −0.5 V.
15. Within-device skew defined as identical transitions on similar paths through a device.
16. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.
17. VPP(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈ 40.
Driver
Device
Q
Q
Zo = 50 W
Zo = 50 W
50 W
50 W
D
Receiver
Device
D
VTT
VTT = VCC − 3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
http://onsemi.com
5
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| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet 10EL11.PDF ] | |
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