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PDF LM2409T Data sheet ( Hoja de datos )

Número de pieza LM2409T
Descripción Monolithic Triple 9.5 ns CRT Driver
Fabricantes National Semiconductor 
Logotipo National Semiconductor Logotipo



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August 1999
LM2409
Monolithic Triple 9.5 ns CRT Driver
General Description
The LM2409 is an integrated high voltage CRT driver circuit
designed for use in color monitor applications. The IC con-
tains three high input impedance, wide band amplifiers
which directly drive the RGB cathodes of a CRT. Each chan-
nel has its gain internally set to −14 and can drive CRT ca-
pacitive loads as well as resistive loads present in other ap-
plications, limited only by the package’s power dissipation.
The IC is packaged in an industry standard 11-lead TO-220
molded plastic power package. See Thermal Considerations
section.
Features
n Dissipates approximately 50% less power than the
LM2406
n Well matched with LM1279 video preamp
n 0V to 5V input range
n Stable with 0 pF–20 pF capacitive loads and inductive
peaking networks
n Convenient TO-220 staggered lead package style
n Standard LM240X Family Pinout which is designed for
easy PCB layout
Applications
n 1024 x 768 Displays up to 70 Hz Refresh
n Pixel clock frequencies up to 75 MHz
n Monitors using video blanking
Schematic and Connection Diagrams
DS100838-1
FIGURE 1. Simplified Schematic Diagram
(One Channel)
DS100838-2
Note: Tab is at GND
Top View
Order Number LM2409T
© 1999 National Semiconductor Corporation DS100838
www.national.com

1 page




LM2409T pdf
Application Hints (Continued)
OPTIMIZING TRANSIENT RESPONSE
Referring to Figure 9, there are three components (R1, R2
and L1) that can be adjusted to optimize the transient re-
sponse of the application circuit. Increasing the values of R1
and R2 will slow the circuit down while decreasing over-
shoot. Increasing the value of L1 will speed up the circuit as
well as increase overshoot. It is very important to use induc-
tors with very high self-resonant frequencies, preferably
above 300 MHz. Ferrite core inductors from J.W. Miller Mag-
netics (part # 78FR82K) were used for optimizing the perfor-
mance of the device in the NSC application board. The val-
ues shown in Figure 9 can be used as a good starting point
for the evaluation of the LM2409. The NSC demo board also
has a position open to add a resistor in parallel with L1. This
resistor can be used to help control overshoot. Using vari-
able resistors for R1 and the parallel resistor will simplify
finding the values needed for optimum performance in a
given application. Once the optimum values are determined
the variable resistors can be replaced with fixed values.
EFFECT OF LOAD CAPACITANCE
Figure 8 shows the effect of increased load capacitance on
the speed of the device. This demonstrates the importance
of knowing the load capacitance in the application.
EFFECT OF OFFSET
Figure 7 shows the variation in rise and fall times when the
output offset of the device is varied from 40 VDC to 50 VDC.
The rise time shows a maximum variation relative to the cen-
ter data point (45 VDC) of about 21%. The fall time shows a
variation of about 3% relative to the center data point.
THERMAL CONSIDERATIONS
Figure 4 shows the performance of the LM2409 in the test
circuit shown in Figure 2 as a function of case temperature.
The figure shows that the rise time of the LM2409 increases
by approximately 3% as the case temperature increases
from 50˚C to 100˚C. This corresponds to a speed degrada-
tion of 0.6% for every 10˚C rise in case temperature. The fall
time increases by approximately 3% which corresponds to a
speed degradation of 0.6% for every 10˚C rise in case tem-
perature.
Figure 6 shows the maximum power dissipation of the
LM2409 vs Frequency when all three channels of the device
are driving an 8 pF load with a 40 Vp-p alternating one pixel
on, one pixel off signal. The graph assumes a 72% active
time (device operating at the specified frequency) which is
typical in a monitor application. The other 28% of the time
the device is assumed to be sitting at the black level (65V in
this case). This graph gives the designer the information
needed to determine the heat sink requirement for the appli-
cation. The designer should note that if the load capacitance
is increased the AC component of the total power dissipation
will also increase.
The LM2409 case temperature must be maintained below
115˚C.
If the maximum expected ambient temperature is 70˚C and
the maximum power dissipation is 3.4W (from Figure 6, 40
MHz bandwidth) then a maximum heat sink thermal resis-
tance can be calculated:
This example assumes a capacitive load of 8 pF and no re-
sistive load.
TYPICAL APPLICATION
A typical application of the LM2409 is shown in Figure 10.
Used in conjunction with an LM1279, a complete video chan-
nel from monitor input to CRT cathode can be achieved. Per-
formance is ideal for 1024 x 768 resolution displays with
pixel clock frequencies up to 75 MHz. Figure 10 is the sche-
matic for the NSC demonstration board that can be used to
evaluate the LM1279/2409 combination in a monitor.
PC BOARD LAYOUT CONSIDERATIONS
For optimum performance, an adequate ground plane, isola-
tion between channels, good supply bypassing and minimiz-
ing unwanted feedback are necessary. Also, the length of the
signal traces from the preamplifier to the LM2409 and from
the LM2409 to the CRT cathode should be as short as pos-
sible. The following references are recommended:
Ott, Henry W., “Noise Reduction Techniques in Electronic
Systems”, John Wiley & Sons, New York, 1976.
“Guide to CRT Video Design”, National Semiconductor Appli-
cation Note 861.
“Video Amplifier Design for Computer Monitors”, National
Semiconductor Application Note 1013.
Pease, Robert A., “Troubleshooting Analog Circuits”,
Butterworth-Heinemann, 1991.
Because of its high small signal bandwidth, the part may os-
cillate in a monitor if feedback occurs around the video chan-
nel through the chassis wiring. To prevent this, leads to the
video amplifier input circuit should be shielded, and input cir-
cuit wiring should be spaced as far as possible from output
circuit wiring.
NSC DEMONSTRATION BOARD
Figure 11 shows routing and component placement on the
NSC LM1279/2409 demonstration board. The schematic of
the board is shown in Figure 10. This board provides a good
example of a layout that can be used as a guide for future
layouts. Note the location of the following components:
C55 — VCC bypass capacitor, located very close to pin 6
and ground pins
C43, C44 — VBB bypass capacitors, located close to pin
10 and ground
C53–C55 — VCC bypass capacitors, near LM2409 and
VCC clamp diodes. Very important for arc protection.
The routing of the LM2409 outputs to the CRT is very critical
to achieving optimum performance. Figure 12 shows the
routing and component placement from pin 1 of the LM2409
to the blue cathode. Note that the components are placed so
that they almost line up from the output pin of the LM2409 to
the blue cathode pin of the CRT connector. This is done to
minimize the length of the video path between these two
components. Note also that D14, D15, R29 and D13 are
placed to minimize the size of the video nodes that they are
attached to. This minimizes parasitic capacitance in the
video path and also enhances the effectiveness of the pro-
tection diodes. The anode of protection diode D14 is con-
nected directly to a section of the the ground plane that has
a short and direct path to the LM2409 ground pins. The cath-
ode of D15 is connected to VCC very close to decoupling ca-
pacitor C55 (see Figure 12) which is connected to the same
section of the ground plane as D14. The diode placement
and routing is very important for minimizing the voltage
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