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PDF 11577-11 Data sheet ( Hoja de datos )
| Número de pieza | 11577-11 | |
| Descripción | Digital Correlator | |
| Fabricantes | Rockwell | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de 11577-11 (archivo pdf) en la parte inferior de esta página. Total 48 Páginas | ||
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Construction Analysis
Rockwell 11577-11
Digital Correlator
Report Number: SCA 9707-546
al Semiconductor Ind
®
17350 N. Hartford Drive
Scottsdale, AZ 85255
Phone: 602-515-9780
Fax: 602-515-9781
e-mail: [email protected]
Internet: http://www.ice-corp.com
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TECHNOLOGY DESCRIPTION (continued)
• Polysilicon: A single layer of polycide (titanium silicide on poly) was used to form
all gates on the die. Direct poly-to-diffusion (buried) contacts were not used.
Definition was by a dry etch of normal quality.
• Diffusions: Standard implanted N+ and P+ diffusions formed the sources/drains of
the CMOS transistors. An LDD process was used with oxide sidewall spacers left in
place.
• Wells: P-well CMOS process in an N-epi on a P-substrate. No step was present at
well boundaries.
• Memory cells: On-board MROM memory design used metal 2 “piggy-back” word
lines via metal 1 links. Metal 1 was used to form the bit lines. Polycide was used to
form the word lines. Programming is achieved at the field (local) oxide cut.
• Redundancy: Fuses were not used.
• Design features: Slotted and beveled Metal 2 bus lines were employed for stress
relief. Both metals one and two were used in the bond pads.
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OVERALL QUALITY EVALUATION: Overall Rating: Normal
DETAIL OF EVALUATION
Package integrity
Package markings
Die placement
Die attach quality
Wire spacing
Wirebond placement
Wirebond quality
Dicing quality
Wirebond method
Die attach method
Dicing method
G
N
N
G
G
G
G
G
Thermosonic ball bond method using 1.1 mil
O.D. gold wire.
Silver-epoxy
Sawn (full depth)
Die surface integrity:
Tool marks (absence)
Particles (absence)
Contamination (absence)
Process defects
General workmanship
Passivation integrity
Metal definition
Metal integrity
Metal registration
Contact coverage
Contact registration
G
G
G
G
N
G
N
N
N
N
N
G = Good, P = Poor, N = Normal, NP = Normal/Poor
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11 Page | ||
| Páginas | Total 48 Páginas | |
| PDF Descargar | [ Datasheet 11577-11.PDF ] | |
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