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PDF FSA2270 Data sheet ( Hoja de datos )
| Número de pieza | FSA2270 | |
| Descripción | Dual-SPDT Analog Switch | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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www.DataSheet4U.com
June 2007
FSA2270 / FSA2270T Low-Voltage, Dual-SPDT (0.4Ω)
Analog Switch with Negative Swing Audio Capability
Features
0.4Ω Typical On Resistance (RON) for +3.0V Supply
0.25Ω Maximum RON Flatness for +3.0V Supply
-3db Bandwidth: > 50MHz
Low-ICCT Current Over Expanded Control Input Range
Packaged in Pb-free, 10-Lead UMLP
Power-Off Protection on Common Ports
Broad VCC Operating Range: 1.65 to 4.3V
Noise Immunity Termination Resistors in FSA2270T
Low Electrostatic Discharge (ESD)
- Human Body Model (JEDEC: JESD22-A114)
Power to GND
I/O to GND
All other pins
16kv
11kv
8kv
- Charged Device Model (JEDEC: JESD22-A101)
Applications
Cell Phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Description
The FSA2270 is a high-performance, dual Single-Pole
Double-Throw (SPDT) analog switch with negative swing
audio capability. The FSA2270 features ultra-low RON of
0.4Ω (typical) at 3.0V VCC. The FSA2270 operates over a
wide VCC range of 1.65V to 4.3V, is fabricated with sub-
micron CMOS technology to achieve fast switching
speeds, and is designed for break-before-make
operation. The select input is TTL-level compatible.
The FSA2270 features very low quiescent current even
when the control voltage is lower than the VCC supply.
This feature suits mobile handset applications by
allowing direct interface with baseband processor
general-purpose I/Os with minimal battery consumption.
The FSA2270T includes termination resistors that
improve noise immunity during overshoot excursions,
off-isolation coupling, or “pop-minimization.”
IMPORTANT NOTE:
For additional performance information, please contact
Ordering Information
Part Number
FSA2270UMX (Preliminary)
FSA2270TUMX
Analog Symbols
Top Mark
HJ
HK
1B0
1B1 1A
S1
2B0
2B1 2A
S2
Figure 1. FSA2270
© 2007 Fairchild Semiconductor Corporation
FSA2270 / FSA2270T Rev. 1.0.0
Pb-Free
Yes
Yes
Package Description
10-Lead, Quad Ultrathin Molded Leadless Package
(UMLP), 1.4 x 1.8mm, 0.4mm pitch
10-Lead, Quad Ultrathin Molded Leadless Package
(UMLP), 1.4 x 1.8mm, 0.4mm pitch
1B0
1B1 1A
S1
10k
GND
2B0
2B1
2A
S2
10k
GND
Figure 2. FSA2270T
www.fairchildsemi.com
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet FSA2270.PDF ] | |
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