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PDF 48LC8M8A2 Data sheet ( Hoja de datos )

Número de pieza 48LC8M8A2
Descripción MT48LC8M8A2
Fabricantes Micron Technology 
Logotipo Micron Technology Logotipo



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SYNCHRONOUS
DRAM
FEATURES
• PC66-, PC100-, and PC133-compliant
• Fully synchronous; all signals registered on
positive edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto Precharge, includes CONCURRENT AUTO
PRECHARGE, and Auto Refresh Modes
• Self Refresh Modes: standard and low power
• 64ms, 4,096-cycle refresh
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
OPTIONS
MARKING
• Configurations
16 Meg x 4 (4 Meg x 4 x 4 banks)
16M4
8 Meg x 8 (2 Meg x 8 x 4 banks)
8M8
4 Meg x 16 (1 Meg x 16 x 4 banks)
4M16
• WRITE Recovery (tWR)
tWR = “2 CLK”1
A2
• Plastic Package – OCPL2
54-pin TSOP II (400 mil)
TG
• Timing (Cycle Time)
10ns @ CL = 2 (PC100)
7.5ns @ CL = 3 (PC133)
7.5ns @ CL = 2 (PC133)
6ns @ CL = 3 (PC133, x16 Only)
-8E 3, 4,5
-75
-7E
-6
• Self Refresh
Standard
Low Power
None
L
• Operating Temperature Range
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
None
IT 3
Part Number Example:
MT48LC8M8A2TG-75
NOTE: 1. Refer to Micron Technical Note: TN-48-05.
2. Off-center parting line.
3. Consult Micron for availability.
4. Not recommended for new designs.
5. Shown for PC100 compatibility.
64Mb: x4, x8, x16
SDRAM
MT48LC16M4A2 – 4 Meg x 4 x 4 banks
MT48LC8M8A2 – 2 Meg x 8 x 4 banks
MT48LC4M16A2 – 1 Meg x 16 x 4 banks
For the latest data sheet, please refer to the Micron Web
site: www.micron.com/dramds
PIN ASSIGNMENT (Top View)
x4 x8 x16
- - VDD
NC DQ0 DQ0
- - VDDQ
NC NC DQ1
DQ0 DQ1 DQ2
- - VssQ
NC NC DQ3
NC DQ2 DQ4
- - VDDQ
NC NC DQ5
DQ1 DQ3 DQ6
- - VssQ
NC NC DQ7
- - VDD
NC NC DQML
- - WE#
- - CAS#
- - RAS#
- - CS#
- - BA0
- - BA1
- - A10
- - A0
- - A1
- - A2
- - A3
- - VDD
54-Pin TSOP
1 54
2 53
3 52
4 51
5 50
6 49
7 48
8 47
9 46
10 45
11 44
12 43
13 42
14 41
15 40
16 39
17 38
18 37
19 36
20 35
21 34
22 33
23 32
24 31
25 30
26 29
27 28
x16 x8 x4
Vss - -
DQ15 DQ7 NC
VssQ - -
DQ14 NC NC
DQ13 DQ6 DQ3
VDDQ -
-
DQ12 NC NC
DQ11 DQ5 NC
VssQ - -
DQ10 NC NC
DQ9 DQ4 DQ2
VDDQ -
-
DQ8 NC NC
Vss - -
NC - -
DQMH DQM DQM
CLK - -
CKE - -
NC - -
A11 - -
A9 - -
A8 - -
A7 - -
A6 - -
A5 - -
A4 - -
Vss - -
Note: The # symbol indicates signal is active LOW. A dash (–)
indicates x8 and x4 pin function is same as x16 pin function.
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
16 Meg x 4
4 Meg x 4 x 4 banks
4K
4K (A0-A11)
4 (BA0, BA1)
1K (A0-A9)
8 Meg x 8
2 Meg x 8 x 4 banks
4K
4K (A0-A11)
4 (BA0, BA1)
512 (A0-A8)
4 Meg x 16
1 Meg x 16 x 4 banks
4K
4K (A0-A11)
4 (BA0, BA1)
256 (A0-A7)
KEY TIMING PARAMETERS
SPEED
GRADE
-6
-7E
-75
-7E
-8E 3, 4, 5
-75
-8E 3, 4, 5
CLOCK
FREQUENCY
166 MHz
143 MHz
133 MHz
133 MHz
125 MHz
100 MHz
100 MHz
ACCESS TIME SETUP
CL = 2* CL = 3* TIME
– 5.5ns 1.5ns
– 5.4ns 1.5ns
– 5.4ns 1.5ns
5.4ns – 1.5ns
– 6ns 2ns
6ns – 1.5ns
6ns – 2ns
HOLD
TIME
1ns
0.8ns
0.8ns
0.8ns
1ns
0.8ns
1ns
* CL = CAS (READ) latency
64Mb: x4, x8, x16 SDRAM
64MSDRAM_F.p65 – Rev. F; Pub. 1/03
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003, Micron Technology, Inc.

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48LC8M8A2 pdf
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FUNCTIONAL BLOCK DIAGRAM
8 Meg x 8 SDRAM
64Mb: x4, x8, x16
SDRAM
CKE
CLK
CS#
WE#
CAS#
RAS#
CONTROL
LOGIC
BANK3
BANK2
BANK1
MODE REGISTER
12
A0-A11,
BA0, BA1
14
ADDRESS
REGISTER
REFRESH 12
COUNTER
12
ROW-
ADDRESS
MUX
12
BANK0
ROW-
ADDRESS
LATCH
&
DECODER
4096
BANK0
MEMORY
ARRAY
(4,096 x 512 x 8)
SENSE AMPLIFIERS
4096
2
BANK
CONTROL
LOGIC
2
COLUMN-
ADDRESS
9
9 COUNTER/
LATCH
I/O GATING
DQM MASK LOGIC
READ DATA LATCH
WRITE DRIVERS
512
(x8)
COLUMN
DECODER
11
DATA
8 OUTPUT
REGISTER
DATA
8 INPUT
REGISTER
8
DQM
DQ0-DQ7
64Mb: x4, x8, x16 SDRAM
64MSDRAM_F.p65 – Rev. F; Pub. 1/03
5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003, Micron Technology, Inc.

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48LC8M8A2 arduino
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Commands
Truth Table 1 provides a quick reference of
available commands. This is followed by a written de-
scription of each command. Three additional Truth
64Mb: x4, x8, x16
SDRAM
Tables appear following the Operation section; these
tables provide current state/next state information.
TRUTH TABLE 1 – COMMANDS AND DQM OPERATION
(Note: 1)
NAME (FUNCTION)
COMMAND INHIBIT (NOP)
NO OPERATION (NOP)
ACTIVE (Select bank and activate row)
READ (Select bank and column, and start READ burst)
WRITE (Select bank and column, and start WRITE burst)
BURST TERMINATE
PRECHARGE (Deactivate row in bank or banks)
AUTO REFRESH or SELF REFRESH
(Enter self refresh mode)
LOAD MODE REGISTER
Write Enable/Output Enable
Write Inhibit/Output High-Z
CS# RAS# CAS# WE# DQM ADDR DQs NOTES
HXXXX
X
X
L HHHX
X
X
L L H H X Bank/Row X
3
L H L H L/H8 Bank/Col X
4
L H L L L/H8 Bank/Col Valid 4
L HH L X
X Active
L LHLX
Code
X
5
L L LHX
X
X 6, 7
L L L L X Op-Code X
2
––––L
– Active 8
– – – –H
– High-Z 8
NOTE:
1. CKE is HIGH for all commands shown except SELF REFRESH.
2. A0-A11 define the op-code written to the mode register.
3. A0-A11 provide row address, and BA0, BA1 determine which bank is made active.
4. A0-A9 (x4), A0-A8 (x8), or A0-A7 (x16) provide column address; A10 (HIGH) enables the auto precharge feature
(nonpersistent), while A10 (LOW) disables the auto precharge feature; BA0, BA1 determine which bank is being read
from or written to.
5. A10 (LOW): BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are “Don’t
Care.”
6. This command is AUTO REFRESH if CKE is (HIGH), SELF REFRESH if CKE is LOW.
7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.
8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).
64Mb: x4, x8, x16 SDRAM
64MSDRAM_F.p65 – Rev. F; Pub. 1/03
11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2003, Micron Technology, Inc.

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