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PDF P8NC50FP Data sheet ( Hoja de datos )

Número de pieza P8NC50FP
Descripción STP8NC50FP
Fabricantes STMicroelectronics 
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No Preview Available ! P8NC50FP Hoja de datos, Descripción, Manual

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STP8NC50 - STP8NC50FP
STB8NC50-1
N-CHANNEL 500V - 0.7- 8A TO-220/TO-220FP/I2PAK
PowerMesh™II MOSFET
TYPE
VDSS
RDS(on)
ID
STP(B)8NC50(-1) 500 V < 0.85
8A
STP8NC50FP
500 V < 0.85
8A
s TYPICAL RDS(on) = 0.7
s EXTREMELY HIGH dv/dt CAPABILITY
s 100% AVALANCHE TESTED
s NEW HIGH VOLTAGE BENCHMARK
s GATE CHARGE MINIMIZED
DESCRIPTION
The PowerMESHII is the evolution of the first
generation of MESH OVERLAY™. The layout re-
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lead-
ing edge for what concerns swithing speed, gate
charge and ruggedness.
APPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING
s SWITH MODE POWER SUPPLIES (SMPS)
s DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVES
TO-220
3
2
1
TO-220FP
123
I²PAK
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDS Drain-source Voltage (VGS = 0)
VDGR
Drain-gate Voltage (RGS = 20 k)
VGS Gate- source Voltage
ID Drain Current (continuos) at TC = 25°C
ID Drain Current (continuos) at TC = 100°C
IDM (q) Drain Current (pulsed)
PTOT
Total Dissipation at TC = 25°C
Derating Factor
dv/dt (1) Peak Diode Recovery voltage slope
VISO
Insulation Withstand Voltage (DC)
Tstg Storage Temperature
Tj Max. Operating Junction Temperature
(•)Pulse width limited by safe operating area
(*) Limited only by maximum temperature allowed
December 2000
Value
STP(B)8NC50(-1) STP8NC50FP
500
500
±30
8 8(*)
5.4 5.4(*)
32 32(*)
135 40
1.075
0.32
3
- 2000
–65 to 150
150
Unit
V
V
V
A
A
A
W
W/°C
V/ns
V
°C
°C
(1)ISD 8A, di/dt 100A/µs, VDD V(BR)DSS, Tj TJMAX.
1/10

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P8NC50FP pdf
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Gate Charge vs Gate-source Voltage
STP8NC50/FP/STB8NC50-1
Capacitance Variations
Normalized Gate Threshold Voltage vs Temp.
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/10

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