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PDF ICSSSTUB32864A Data sheet ( Hoja de datos )
| Número de pieza | ICSSSTUB32864A | |
| Descripción | 25-Bit Configurable Registered Buffer | |
| Fabricantes | ICS | |
| Logotipo |  |
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Integrated
Circuit
Systems, Inc.
ICSSSTUB32864A
Advance Information
25-Bit Configurable Registered Buffer for DDR2
Recommended Application:
• DDR2 Memory Modules
• Provides complete DDR DIMM solution with
ICS97U877
• Ideal for DDR2 400, 533, 667 and 800
Product Features:
• 25-bit 1:1 or 14-bit 1:2 configurable registered buffer
• Supports SSTL_18 JEDEC specification on data
inputs and outputs
• Supports LVCMOS switching levels on C0, C1 and
RESET# inputs
• Low voltage operation
VDD = 1.7V to 1.9V
• Available in 96 BGA package
• Drop-in replacement for ICSSSTUB32866
• Green packages available
Pin Configuration
123456
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
96 Ball BGA
(Top View)
Truth Table
I nputs
Outp uts
RST# DCS# CSR# CK
CK#
Dn,
DODT,
DCK E
Qn
QCS#
QODT,
QCKE
HLL
LL LL
HLL
HHL H
H
L
L L or H L or H X
Q0 Q0 Q0
HLH
LL LL
HLH
HHL H
H
L
H L or H L or H X
Q0 Q0 Q0
HHL
LL HL
HHL
HHHH
H H L L or H L or H X Q0 Q0 Q0
HHH
L Q0 H L
HHH
H Q0 H H
H H H L or H L or H X Q0 Q0 Q0
L
X or X or X or X or X or
Floating Floating Floating Floating Floating
L
L
L
1166—10/05/05
Ball Assignments
A DCKE
B D2
C D3
D DODT
E D5
F D6
G NC
H CK
J CK#
K D8
L D9
M D10
N D11
P D12
R D13
T D14
NC
D15
D16
NC
D17
D18
RST#
DCS#
CSR#
D19
D20
D21
D22
D23
D24
D25
V REF
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
V REF
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
VDD
1234
QCKE
Q2
Q3
NC
Q15
Q16
QODT
Q5
Q6
NC
Q17
Q18
C1 C0
QCS#
ZOH
Q8
NC
ZOL
Q19
Q9 Q20
Q10 Q21
Q11 Q22
Q12 Q23
Q13 Q24
Q14 Q25
56
1:1 Register (C0 = 0, C1 = 0)
1 page  
ICSSSTUB32864A
Advance Information
Block Diagram for 1:2 mode (positive logic)
RST#
CK
CK#
VREF
DCKE
DODT
DCS#
CSR#
1D
C1
R
1D
C1
R
1D
C1
R
QCKEA
QCKE B*
QODTA
QODTB*
QCSA#
QCSB#*
1166—10/05/05
D1 0
1
To 10 Other Channels
*Note: Disabled in 1:1 configuration
1D
C1
R
5
Q1A
Q1B*
5 Page 
ICSSSTUB32864A
Advance Information
Seating
Plane
C
A1 b
T REF
D
TOP VIEW
d TYP
D1
Numeric Designations
for Horizontal Grid
4 321
A
B
C
D
Alpha Designations
for Vertical Grid
(Letters I, O, Q & S
not used)
- e - TYP
E
hc
TYP REF
- e - TYP
0.12 C
E1
ALL DIMENSIONS IN MILLIMETERS
----- BALL GRID -----
Max.
D ET
e
HORIZ
V E RT
TOTAL
d
M in/ M ax
M in/ M ax
13.50 Bsc 5.50 Bsc 1.30/1.50 0.80 Bsc
6
16 96 0.40/0.50
11.50 Bsc 5.00 Bsc
/1.2 0.65 Bsc
6
16 96 0.38/0.48
Note: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
h
M in/ M ax
0.25/0.41
0.27/0.37
REF. DIMENSIONS
bc
0.75
0.875
0. 75
0.875
10-0055C
* Source Ref.: JEDEC Publication 95, MO-205
Ordering Information
ICSSSTUB32864Az(LF)T
Example:
ICS XXXX y z (LF) - T
Designation for tape and reel packaging
Lead Free, RoHS Compliant (Optional)
Package Type
H = LFBGA (standard size: 5.5 x 13.50)
HM = TFBGA (reduced size: 5.0 x 11.50)
Revision Designator (will not correlate with datasheet revision)
Device Type
Prefix
ICS = Standard Device
1166—10/05/05
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ICSSSTUB32864A.PDF ] | |
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