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Número de pieza | BGA2716 | |
Descripción | MMIC wideband amplifier | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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BGA2716
MMIC wideband amplifier
Rev. 02 — 24 September 2004
Product data sheet
1. Product profile
CAUTION
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 SMD plastic package.
This device is sensitive to electrostatic discharge (ESD). Therefore care should be taken
during transport and handling.
MSC895
1.2 Features
s Internally matched to 50 Ω
s Wide frequency range (3.2 GHz at 3 dB bandwidth)
s Flat 23 dB gain (±1 dB up to 2.7 GHz)
s 9 dBm output power at 1 dB compression point
s Good linearity for low current (IP3out = 22 dBm)
s Low second harmonic; −38 dBc at PL = −5 dBm
s Unconditionally stable (K ≥ 1.2).
1.3 Applications
s LNB IF amplifiers
s Cable systems
s ISM
s General purpose.
1.4 Quick reference data
Table 1:
Symbol
VS
IS
s212
NF
PL(sat)
Quick reference data
Parameter
DC supply voltage
supply current
insertion power gain
noise figure
saturated load power
Conditions
f = 1 GHz
f = 1 GHz
f = 1 GHz
Min Typ Max Unit
- 56V
- 15.9 - mA
- 22.9 - dB
- 5.3 - dB
- 11.6 - dBm
1 page www.DataSheet4U.com
Philips Semiconductors
BGA2716
MMIC wideband amplifier
30 mm
PH
30 mm
IN
PHILIPS
OUT
V+
PH
IN
PHILIPS
DUT
C2
C1
C3
L1
OUT
V+
001aab256
Material = FR4; thickness = 0.6 mm, εr = 4.6.
Fig 2. PCB layout and demonstration board showing components.
8.1 Application examples
The excellent wideband characteristics of the MMIC make it an ideal building block in IF
amplifier such as LNBs (see Figure 3).
9397 750 13292
Product data sheet
Rev. 02 — 24 September 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
5 of 14
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Philips Semiconductors
9. Package outline
Plastic surface mounted package; 6 leads
DB
BGA2716
MMIC wideband amplifier
SOT363
E AX
y
6
54
pin 1
index
12
e1 bp
e
3
wM B
HE v M A
A
A1
Q
Lp
detail X
c
01
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35 1.3
1.15
0.65
2.2 0.45 0.25
2.0 0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
IEC
REFERENCES
JEDEC
EIAJ
SC-88
Fig 14. Package outline; SOT363 (SC-88).
9397 750 13292
Product data sheet
Rev. 02 — 24 September 2004
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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Páginas | Total 14 Páginas | |
PDF Descargar | [ Datasheet BGA2716.PDF ] |
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