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PDF BAT54J Data sheet ( Hoja de datos )

Número de pieza BAT54J
Descripción Schottky barrier single diode
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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BAT54J
Schottky barrier single diode
Rev. 01 — 8 March 2007
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier single diode with an integrated guard ring for stress protection,
encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device
(SMD) plastic package.
1.2 Features
I Low forward voltage
I Very small and flat lead SMD plastic package
I Low capacitance
I Flat leads: excellent coplanarity and improved thermal behavior
1.3 Applications
I Voltage clamping
I Line termination
I Reverse polarity protection
1.4 Quick reference data
Table 1.
Symbol
IF
VR
VF
Quick reference data
Parameter
forward current
reverse voltage
forward voltage
[1] Pulse test: tp 300 µs; δ ≤ 0.02.
Conditions
IF = 1 mA
Min Typ Max Unit
- - 200 mA
- - 30 V
[1] - - 320 mV

1 page




BAT54J pdf
NXP Semiconductors
8. Package outline
BAT54J
Schottky barrier single diode
1.35
1.15
1
2.7 1.8
2.3 1.6
0.80
0.65
0.5
0.3
Dimensions in mm
2
0.40
0.25
Fig 4. Package outline SOD323F (SC-90)
0.25
0.10
04-09-13
9. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
3 000
10 000
BAT54J
SOD323F 4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
1.65 0.95
3.05
2.80
2.10
1.60
0.50 0.60
0.50
(2×)
001aab169
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD323F (SC-90)
solder lands
solder resist
occupied area
solder paste
BAT54J_1
Product data sheet
Rev. 01 — 8 March 2007
© NXP B.V. 2007. All rights reserved.
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