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PDF V048L015T80 Datasheet ( Hoja de datos )

Número de pieza V048L015T80
Descripción Voltage Transformation Module
Fabricantes Vicor Corporation 
Logotipo Vicor Corporation Logotipo
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V048L015T80 datasheet

1 Page

V048L015T80 pdf
Specifications, continued
GENERAL
Parameter
Min Typ Max Unit
Note
MTBF
MIL-HDBK-217F
3.6
Mhrs
25°C, GB
Telcordia TR-NT-000332
4.2 Mhrs
Telcordia SR-332
TBD hrs
Demonstrated
TBD hrs
Isolation specifications
Voltage
1,500
Vdc Input to Output
Capacitance
5,100
6,000
pF
Input to Output
Resistance
10
MInput to Output
Agency approvals (pending)
cTÜVus
UL/CSA 60950, EN 60950
CE Mark
Low voltage directive
Mechanical parameters
See mechanical drawing, Figs.16 and 18
Weight
Dimensions
Length
Width
P R E L I M I N A RYHeight
0.43 / 12.25
1.26 / 32
0.85 / 21.5
0.24 / 6
oz / g
in / mm
in / mm
in / mm
Auxiliary Pins (Conditions are at nominal line, full load, and 25°C ambient unless otherwise specified)
Parameter
Primary Control (PC)
DC voltage
Module disable voltage
Module enable voltage
Min Typ Max Unit
4.8 5.0 5.2
2.4 2.5
2.5 2.6
V
V
V
Note
Current limit
2.4 2.5 2.9 mA
Source only
Enable delay time
300 450
µs
See Fig.2
Disable delay time
4 10 µs
Temperature Monitor (TM)
27°C setting
2.95 3.00 3.05
V
Operating junction temperature
Temperature coefficient
10 mV/°C
Full range accuracy
-5 5 °C Operating junction temperature
Current limit
100
µA Source only
Figure 13— VOUT at full load vs. PC disable
Figure 14— PC signal during fault
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 5 of 20

5 Page

V048L015T80 arduino
Configuration Options (Cont.)
21.5
0.85
PRELIMINARY
22.0
0.87
32.0
32.0
1.26
1.26
11.7
0.46
IN–BOARD MOUNT
with 0.25'' Pin Fins
(V•I Chip recessed into PCB)
Figure 22— In-board with Pin Fins – package L
14.0
0.56
ON–BOARD MOUNT
with 0.25'' Pin Fins
mm
in
Figure 23— On-board with Pin Fins – package G
mm
in
F1
7A
Fuse
C1
100 µF
Al electrolytic
Input reflected ripple
measurement point
C2
0.47 µF
ceramic
Enable/Disable Switch
R2
2K
SW1 D1
+In +Out
PC
SG VTM
TM
–In –Out
C3
100 µF
+
Load
Notes:
+
Temperature Monitor
C3 should be placed close to the load.
D1 power good indicator will dim when a module fault is detected.
TM should always be referenced to SG.
Figure 24—VTM test circuit
Application Note
Parallel Operation
In applications requiring higher current or redundancy, VTMs
can be operated in parallel without adding control circuitry or
signal lines. To maximize current sharing accuracy, it is
imperative that the source and load impedance on each VTM in
a parallel array be equal.
To achieve matched impedances, dedicated power planes
within the PC board should be used for the output and output
return paths to the array of paralleled VTMs. This technique is
preferable to using traces of varying size and length.
The VTM power train and control architecture allow bi-directional
power transfer when the VTM is operating within its specified
ranges. Bi-directional power processing improves transient
response in the event of an output load dump. The VTM may
operate in reverse, returning output power back to the input
source. It does so efficiently.
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
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