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PDF V048K160T015 Datasheet ( Hoja de datos )

Número de pieza V048K160T015
Descripción (V048x160x015) Voltage Transformation Module
Fabricantes Vicor Corporation 
Logotipo Vicor Corporation Logotipo

Total 15 Páginas
		
V048K160T015 Hoja de datos, Descripción, Manual
www.DataSheet4U.com
VTM
PRELIMINARY
V•I ChipTM – VTM
Voltage Transformation Module
• 48 V to 16 V V•I Chip Converter
• 15.0 A (22.5 A for 1 ms)
• High density – 974 W/in3
• Small footprint – 220 W/in2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
• 1 µs transient response
• 3.5 million hours MTBF
• Typical efficiency 96%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K160T015
K indicates BGA configuration. For other
mounting options see Part Numbering below.
©
Vf = 26 - 55 V
VOUT = 8.67 - 18.3 V
IOUT = 15.0 A
K = 1/3
ROUT = 35.0 mmax
Actual size
Product Description
The V048K160T015 V•I Chip Voltage Transformation
Module (VTM) excels at speed, density and efficiency to
meet the demands of advanced power applications
while providing isolation from input to output. It
achieves a response time of less than 1 µs and delivers
up to 15.0 A in a volume of less than 0.25 in3 with
unprecedented efficiency. It may be paralleled to deliver
higher power levels at an output voltage settable from
8.67 to 18.3 Vdc.
The VTM V048K160T015’s nominal output voltage is
16 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 8.67 to 18.3 Vdc at no load, and from
8.15 to 17.9 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/3 , for applications requiring an isolated output
voltage with high efficiency. Closing the loop back to an
input Pre-Regulation Module (PRM) or DC-DC converter
enables tight load regulation.
The 16 V VTM achieves a power density of 974 W/in3 in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip BGA package supports in-board mounting with
a low profile of 0.16" (4 mm) over the board. A J-lead
package option supports on-board surface mounting
with a profile of only 0.25" (6 mm) over the board. The
VTM’s fast dynamic response and low noise eliminate the
need for bulk capacitance at the load, substantially
increasing system density while improving reliability and
decreasing cost.
Absolute Maximum Ratings
Parameter
+In to -In
+In to -In
PC to -In
VC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature(1)
Values
-1.0 to 60.0
100
-0.3 to 7.0
-0.3 to 19.0
-0.1 to 25.0
2,250
15.0
22.5
269
403
208
-40 to 125
-55 to 125
Storage temperature
-40 to 150
-65 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
During reflow
T - Grade
M - Grade
T - Grade
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
V 048
Voltage
Transformation
Module
Input Voltage
Designator
K
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
160
Output Voltage
Designator
(=VOUT x10)
T
015
Output Current
Designator
(=IOUT)
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
M -65 to150 -55 to125
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K160T015
Rev. 1.0
Page 1 of 15

1 page

V048K160T015 pdf
Electrical Specifications (continued)
PRELIMINARY
Thermal
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient (1)
Junction-to-ambient (2)
Min
125
Typ Max
130 135
0.61
1.1
2.1
6.5
5.0
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Notes:
(1) V048K160T015 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) V048K160T015 with a 0.25"H heatsink surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
V•I Chip Stress Driven Product Qualification Process
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Highly Accelerated Life Testing (HALT)
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification(1)
Dynamic cycling
Per Vicor internal
test specification(1)
Note:
(1) For details of the test protocols see Vicor’s website.
V•I Chip Ball Grid Array Interconnect Qualification
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20°C to 125°C
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K160T015
Rev. 1.0
Page 5 of 15

5 Page

V048K160T015 arduino
Application Note (continued)
PRELIMINARY
Figure 17—Thermal resistance
VTM with 0.25'' heat sink
10
9
8
7
6
5
4
3
0 100 200 300 400 500 600
Airflow (LFM)
Figure 18—Junction-to-ambient thermal resistance of VTM with 0.25"
Heat Sink.
V•I Chip VTM Level 1 DC Behavioral Model for 48 V to 16 V, 15.0 A
IOUT
ROUT
+
29.7 m
+
1/3 • Iout
VI
1/3 • Vin
++
VIN IQ
65 mA
––
K
VOUT
©
Figure 19—This model characterizes the DC operation of the V•I Chip VTM, including the converter transfer function and its losses. The model enables estimates
or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V•I Chip VTM Level 2 Transient Behavioral Model for 48 V to 16 V, 15.0 A
LLININ==2200nnHH
IOUT
1.8 nH
ROUT
+
R1R.C3CINmIN
VI
6.9 m
29.7 m
CIN 4.0 µF
1/3 • Iout
1/3 • Vin
++
COUT
VIN IQ
65 mA
––
K
LOUT = 1.6 nH
RRCCOOUUTT
0.21 m
25.4 µF
+
VOUT
Figure 20—This model characterizes the AC operation of the V•I Chip VTM including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load
with or without external filtering elements.
©
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K160T015
Rev. 1.0
Page 11 of 15

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