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PDF V048K120T025 Datasheet ( Hoja de datos )

Número de pieza V048K120T025
Descripción (V048x120x025) Voltage Transformation Module
Fabricantes Vicor Corporation 
Logotipo Vicor Corporation Logotipo
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V048K120T025 datasheet

1 Page

V048K120T025 pdf
Electrical Specifications (continued)
PRELIMINARY
Thermal
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient (1)
Junction-to-ambient (2)
Min
125
Typ Max
130 135
0.61
1.1
2.1
6.5
5.0
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Notes:
(1) V048K120T025 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) V048K120T025 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
V•I Chip Stress Driven Product Qualification Process
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Highly Accelerated Life Testing (HALT)
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification(1)
Dynamic cycling
Per Vicor internal
test specification(1)
Note:
(1) For details of the test protocols see Vicor’s website.
V•I Chip Ball Grid Array Interconnect Qualification
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20°C to 125°C
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 5 of 16

5 Page

V048K120T025 arduino
Application Note (continued)
PRELIMINARY
Figure 17—Thermal resistance
VTM with optional 0.25'' Pin Fins
10
9
8
7
6
5
4
3
0 100 200 300 400 500 600
Airflow (LFM)
Figure 18—Junction-to-ambient thermal resistance of VTM with 0.25"
Pin Fins. (Pin Fins are available as a separate item.)
V•I Chip VTM Level 1 DC Behavioral Model for 48 V to 12 V, 25 A
IOUT
ROUT
+
11.7 m
+
1/4 • Iout
VI
1/4 • Vin
++
VIN IQ
99 mA
––
K
VOUT
©
Figure 19—This model characterizes the DC operation of the V•I Chip VTM, including the converter transfer function and its losses. The model enables estimates
or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V•I Chip VTM Level 2 Transient Behavioral Model for 48 V to 12 V, 25 A
LLININ==2200nnHH
IOUT
8.5 nH
ROUT
+
R2R.C5CImNIN
VI
40 m
11.7 m
CIN 4 µF
1/4 • Iout
1/4 • Vin
++
COUT
VIN IQ
99 mA
––
K
LOUT = 1.1 nH
RRCOUT
1 µ
55 µF
+
VOUT
Figure 20—This model characterizes the AC operation of the V•I Chip VTM including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load
with or without external filtering elements.
©
vicorpower.com 800-735-6200
V•I Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
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