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PDF V048K015T090 Datasheet ( Hoja de datos )

Número de pieza V048K015T090
Descripción (V048x015T090) Voltage Transformation Module
Fabricantes Vicor Corporation 
Logotipo Vicor Corporation Logotipo

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V048K015T090 Hoja de datos, Descripción, Manual
www.DataSheet4U.com
VTM
V•I ChipTM – VTM
Voltage Transformation Module
V048K015T090
K indicates BGA configuration. For other
mounting options see Part Numbering below.
• 48 V to 1.5 V V•I Chip Converter
• 90 A (135 A for 1 ms)
• High density – 360 A/in3
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
Vf = 26 - 55 V
VOUT = 0.8 - 1.7 V
IOUT = 90 A
K = 1/32
ROUT = 1.2 mmax
©
• Small footprint – 84 A/in2
• Typical efficiency 93% at 1.5 V/50 A
• Low weight – 0.5 oz (14 g)
• No output filtering required
• Pick & Place / SMD
• BGA or J-Lead packages
Actual size
Product Description
Absolute Maximum Ratings
The V048K015T090 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
Parameter
Values
Unit
Notes
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
+In to -In
+In to -In
-1.0 to 60.0
Vdc
100 Vdc For 100 ms
isolation from input to output. It achieves a response
PC to -In
-0.3 to 7.0
Vdc
time of less than 1 µs and delivers up to 90 A in a
TM to -In
-0.3 to 7.0
Vdc
volume of less than 0.25 in3 while providing low output
voltages with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 0.8 to 1.7 Vdc.
P R E L I M I N A RYThe VTM V048K015T090’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, Vf, and is
controllable from 0.8 to 1.7 Vdc at no load, and from
0.8 to 1.6 Vdc at full load, over a Vf input range of 26
to 55 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/32, and an output resistance, ROUT = 1.0 milliohm, to
enable applications requiring a programmable low
output voltage at high current and high efficiency.
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.1 to 4.0
Vdc
Isolation voltage
Operating junction temperature
2,250
-40 to 125
Vdc Input to Output
°C See Note
Output current
90 A Continuous
Peak output current
Case temperature during reflow
135
208
A For 1 ms
°C
Storage temperature
-40 to 150
°C
Output power
Peak output power
145 W Continuous
217 W For 1 ms
Note: The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter can compensate
for ROUT.
Part Numbering
The 1.5 V VTM achieves break-through current density
of 360 A/in3 in a VI Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The VI Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6 mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
V 048
Voltage
Transformation
Module
Input Voltage
Designator
K
Configuration Options
A = On-board, elevated (Fig.16)
F = On-board (Fig.15)
K = In-board (Fig.14)
015 T 090
Output Voltage
Designator
(=VOUT x10)
Output Current
Designator
(=IOUT)
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K015T090 Rev. 1.0
Page 1 of 16

1 page

V048K015T090 pdf
Specifications, continued
THERMAL
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient 1
Junction-to-ambient 2
Min
125
Typ Max
Unit
130 135
°C
0.61 Ws/°C
1.1 °C/W
2.1 °C/W
6.5 °C/W
5.0 °C/W
Notes
1. V048K015T090 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. V048K015T090 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
P R E L I M I N A RYTemperaturecycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Electro static discharge testing – machine model
EIA/JESD22-A115-A
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Per Vicor Internal
Test Specification*
Operation limits verified, destruct margin determined
Dynamic cycling
Per Vicor internal
test specification*
Constant line, 0-100% load, -20°C to 125°C
* For details of the test protocols see Vicor’s website.
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
V•I Chip Voltage Transformation Module V048K015T090 Rev. 1.0
Page 5 of 16

5 Page

V048K015T090 arduino
Application Note (continued)
PRELIMINARY
Figure 18—Thermal resistance
10
9
8
7
6
5
4
3
0
VTM with optional 0.25'' Pin Fins
100 200 300 400 500 600
Airflow (LFM)
Figure 19—Junction-to-ambient thermal resistance of VTM
with 0.25" Pin Fins. (Pin Fins are available as a seperate item.)
V•I Chip VTM LEVEL 1 DC BEHAVIORAL MODEL for 48V to 1.5V, 90A
IOUT
ROUT
+
1.0 m
+
1/32 • Iout
VI
++
1/32 • Vin
VIN IQ
– –52 mA
K
-
VOUT
Figure 20—This model characterizes the DC operation of the V•I Chip VTM, including the converter transfer function
and its losses. The model enables estimates or simulations of output voltage as a function of input voltage and output load, as
well as total converter power dissipation or heat generation.
©
V•I Chip VTM LEVEL 2 TRANSIENT BEHAVIORAL MODEL for 48V to 1.5V, 90A
LIN = 20 nH
+
CIN
VIN
RCIN
1.3 m
4 µF
IQ
52 mA
1/32 • Iout
IOUT
0.15 nH
VI
++
0.6 m
1/32 • Vin
––
K
ROUT
1.0 m
COUT
LOUT = 1.6 nH
RCOUT
65 µ
+
306 µF
VOUT
Figure 21—This model characterizes the AC operation of the V•I Chip VTM including response to output load or input voltage
transients or steady state modulations. The model enables estimates or simulations of input and output voltages under transient
conditions, including response to a stepped load with or without external filtering elements.
©
Vicor Corporation
Tel: 800-735-6200
vicorpower.com
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