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PDF MASWGM0003-DIE Data sheet ( Hoja de datos )
| Número de pieza | MASWGM0003-DIE | |
| Descripción | Switch | |
| Fabricantes | Tyco Electronics | |
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Switch, Single-Pole, Double-Throw
2.0—8.0 GHz
Features
♦ 2.0-8.0 GHz Operation
♦ 3 dB Insertion Loss
♦ Non-Reflective
♦ TTL Control
♦ Excellent Match on Off Port
♦ MSAG™ Process
Description
The MASWGM0003-DIE is a single-pole, double-throw switch that
is fully matched to 50 ohms on both the input and output.
Fabricated using M/A-COM’s repeatable, high performance and
highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™)
Process, each device is 100% RF tested on wafer to ensure
performance compliance.
M/A-COM’s MSAG™ process features robust silicon-like manufac-
turing processes, planar processing of ion implanted transistors,
multiple implant capability enabling power, low-noise, switch and
digital FETs on a single chip, and polyimide scratch protection for
ease of use with automated manufacturing processes. The use of
refractory metals and the absence of platinum in the gate metal
formulation prevents hydrogen poisoning when employed in her-
metic packaging.
MASWGM0003-DIE
903231 —
Preliminary Information
Primary Applications
♦ Test Equipment and Instrumentation
♦ Electronic Warfare
♦ Weather and Military Radar
♦ Point to Point Communications
♦ VSAT
Electrical Characteristics: TB = 25°C1, Z0 = 50Ω, VEE = -5V
Parameter
Symbol
Typical
Bandwidth
f 2.0-8.0
Units
GHz
Insertion Loss @ 4 GHz
IL 1.6 dB
Insertion Loss @ 8 GHz
IL 3.0 dB
Isolation
ISO > 45 dB
Input VSWR
VSWR
1.6:1
Output VSWR (On)
VSWR
1.7:1
Output VSWR (Off)
VSWR
1.7:1
Input Third Order Intercept
ITOI
35 dBm
Input 1-dB Compression Point
P1dB
26 dBm
1. TB = MMIC Base Temperature
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page  
Switch, Single-Pole, Double-Throw
2.0—8.0 GHz
Assembly and Bonding Diagram
100 pF
OUT
1
VEE A
COM
MASWGM0003-DIE
903231 —
Preliminary Information
0.1 μF
VEE
TTL
OUT
2
Figure 4. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Fol-
low the manufacturer’s instructions. If solder is employed, use AuSn (80/20) 1 mil preform solder.
Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially
above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over
ball bonds.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
5 Page | ||
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| PDF Descargar | [ Datasheet MASWGM0003-DIE.PDF ] | |
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