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PDF MASW-005100-1194 Data sheet ( Hoja de datos )
| Número de pieza | MASW-005100-1194 | |
| Descripción | Monolithic PIN SP5T Diode Switch | |
| Fabricantes | Tyco Electronics | |
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Monolithic PIN SP5T Diode Switch
FEATURES
• Ultra Broad Bandwidth: 50MHz to 26GHz
• 1.0 dB Insertion Loss
• 30 dB Isolation at 20GHz
• Reliable.
• Fully Monolithic
• Glass Encapsulated Construction
DESCRIPTION
The MASW-005100-1194 is a SP5T Series-Shunt
broad band switch made with M/A-COM’s HMICTM
(Heterolithic Microwave Integrated Circuit) process,
US Patent 5,268,310. This process allows the
incorporation of silicon pedestals that form series and
shunt diodes or vias by imbedding them in a low loss,
low dispersion glass. This hybrid combination of
Silicon and Glass gives HMIC Switches exceptional
low loss and remarkable high isolation through low
millimeter-wave frequencies.
APPLICATIONS
These high performance switches are suitable for the
use in multi-band ECM, Radar, and instrumentation
control circuits where high isolation to insertion loss
ratios are required. With a standard +5 V/-5 V, TTL
controlled PIN diode driver, 50ns switching speeds are
achieved.
ABSOLUTE MAXIMUM RATINGS
TAMB = +25°C ( Unless otherwise specified )
PARAMETER
OPERATING TEMPERATURE
STORAGE TEMPERATURE
RF C.W. INCIDENT POWER
(± 20 mA )
BIAS CURRENT
( FORWARD )
APPLIED VOLTAGE
( REVERSE )
VALUE
- 65°C to +150°C
- 65°C to +175°C
+33dBm
± 20mA
- 25V
Note:
Exceeding any of these values may result in permanent
damage.
Maximum operating conditions for combination of
RF power, D.C. bias and temperature: +30dBm C.W.,
15mA per diode @+85°C
MASW-005100-1194
Rev 1
1
1 page  
SP5T Monolithic Pin Diode Switch
MASW-005100-1194
Rev 1
ASSEMBLY INSTRUCTIONS
Cleanliness
These chips should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MASW-00 Series PIN switches are ESD, Class 1A sensitive (HBM). The proper ESD handling
procedures must be used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is
recommended. A stage temperature of 150°C and a force of 18 to 22 grams should be used.
Ultrasonic energy should be adjusted to the minimum required. RF bonds should be kept as short as
possible to minimize inductance.
Mounting
These chips have Ti-Pt-Au back metal. They can be die mounted with a 80Au/20Sn or electrically
conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants.
Eu Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C
and a tool tip temperature of 265°C. When hot gas is applied, the tool tip temperature should be
290°C. The chip should not be exposed to temperatures greater than 320°C for more than 10
seconds. No more than three seconds should be required for the die attachment.
Epoxy Die Attachment
Assembly should be preheated to 125°C-150°C. A Controlled thickness of 2 mils is recommended for
best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the
chip after placement to ensure complete coverage. Cure epoxy per manufacturer’s recommended
schedule.
5
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet MASW-005100-1194.PDF ] | |
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