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PDF AH1 Data sheet ( Hoja de datos )

Número de pieza AH1
Descripción High Dynamic Range Amplifier
Fabricantes WJ Communication 
Logotipo WJ Communication Logotipo



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AH1www.DataSheet4U.com
High Dynamic Range Amplifier
Product Features
x 250 – 4000 MHz
x +41 dBm OIP3
x 3 dB Noise Figure
x 13.5 dB Gain
x +22 dBm P1dB
x Lead-free/Green/RoHS-compliant
SOT-89 Package
x Single +5 V Supply
x MTTF > 100 years
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / Wi-Bro / WiMAX
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
Functional Diagram
The AH1 is a high dynamic range amplifier in a low-cost
surface-mount package. The combination of low noise
figure and high output IP3 at the same bias point makes it
ideal for receiver and transmitter applications. The device
combines dependable performance with superb quality to
maintain MTTF values exceeding 100 years at mounting
temperatures of +85 qC. The AH1 is available in the
environmentally-friendly lead-free/green/RoHS-compliant
SOT-89 package.
GND
4
1
RF IN
2
GND
3
RF OUT
The broadband amplifier uses a high reliability GaAs
MMIC technology and is targeted for applications where
high linearity is required. It is well suited for various
current and next generation wireless technologies such as
GPRS, GSM, CDMA, and W-CDMA. In addition, the
AH1 will work for other applications within the 250 to
4000 MHz frequency range such as fixed wireless, W-
LAN, and WiBro.
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure (3)
Operating Current Range
Supply Voltage
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dB
mA
V
Min
250
12.4
+37
120
Typ
800
13.5
8
15
+21.7
+41
3.0
150
5
Max
4000
180
:1. Test conditions unless otherwise noted: T = 25 ºC, 50 system.
2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Noise figure can be optimized by matching the input for optimal return loss.
Typical Performance (4)
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
IS-95 Channel Power (5)
Noise Figure
Supply Voltage
Device Current
Units
MHz
dB
dB
dB
dBm
dBm
dB
dB
V
mA
900
14.2
-21
-14
+21.7
+42
+15.5
3.2
Typical
1900
12.2
-14
-13
+22
+41
+16.5
3.3
5
150
2140
12.0
-21
-11
+22
+40
3.3
4. Parameters reflect performance in an AH1-PCB application circuit, as shown on page 3.
5. Measured with -45 dBc ACPR, IS-95 9 channels fwd.
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
Supply Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85 qC
-55 to +150 qC
+6 V
+10 dBm
+220 qC
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No.
AH1-G
AH1-PCB
Description
High Dynamic Range Amplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
0.8 – 2.5 GHz Fully Assembled Application Circuit
Specifications and information are subject to change without notice.
x x x xWJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com
Page 1 of 5 April 2007

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AH1 pdf
AH1www.DataSheet4U.com
High Dynamic Range Amplifier
AH1-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AH1-G will be marked with an “AH1G”
designator. An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH1” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1B
Value:
Passes 500V to <1000V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V to <2000V
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 qC convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
-40 to +85 qC
59 qC / W
129 qC
1000
100
MTTF vs. GND Tab Temperature
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
10
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85 qC case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 qC.
1
60 70 80 90 100 110
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc x Phone 1-800-WJ1-4401 x FAX: 408-577-6621 x e-mail: [email protected] x Web site: www.wj.com
Page 5 of 5 April 2007

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