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PDF MAAPGM0060-DIE Data sheet ( Hoja de datos )
| Número de pieza | MAAPGM0060-DIE | |
| Descripción | Amplifier | |
| Fabricantes | Tyco Electronics | |
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Amplifier, Power, 5W
4.8-6.7 GHz
Features
♦ 5 Watt Saturated Output Power Level
♦ Variable Drain Voltage (6-10V) Operation
♦ MSAG Process
Description
The MAAPGM0060-DIE is a 2-stage, 5 W power amplifier with on-chip
bias networks. This product is fully matched to
50 ohms on both the input and output. It can be used as a power ampli-
fier stage or as a driver stage in high power applications.
Each device is 100% RF tested on wafer to ensure performance
compliance. The part is fabricated using M/A-COM’s repeatable, high
performance and highly reliable GaAs Multifunction Self-Aligned Gate
(MSAG) Process. This process provides polyimide scratch protection.
MAAPGM0060-DIE
903186 —
Preliminary Information
Primary Applications
♦ Point-to-Point Radio
♦ SatCom
♦ Broadband Wireless Access
Electrical Characteristics: TB = 40°C1, Z0 = 50 Ω, VDD = 8V, Idq ≈ 1.8A2, Pin = 20 dBm, Rg = 100 Ω
Parameter
Bandwidth
Symbol
f
Typical
4.8-6.7
Units
GHz
Output Power
Power Added Efficiency
POUT 37 dBm
PAE
29
%
1-dB Compression Point
P1dB 37 dBm
Small Signal Gain
G 18 dB
Input VSWR
VSWR
3.0:1
Output VSWR
VSWR
1.5:1
Gate Supply Current
Drain Supply Current
IGG < 4 mA
IDD < 2.5
A
1. TB = MMIC Base Temperature
2. Adjust VGG between –2.6 and –1.5V to achieve specified Idq.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1 page  
Amplifier, Power, 5W
4.8-6.7 GHz
Assembly and Bonding Diagram
100 pF
100 pF
100 pF
MAAPGM0060-DIE
903186 —
Preliminary Information
RFIN
RFOUT
VGG
100 Ω
0.1 μF
100 pF
100 pF
100 pF
VDD
0.1 μF
Figure 8. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
5 Page | ||
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