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PDF MA4DP918-1277 Data sheet ( Hoja de datos )
| Número de pieza | MA4DP918-1277 | |
| Descripción | HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package | |
| Fabricantes | Tyco Electronics | |
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HMICTM Integrated Passive Diplexer
GSM/DCS or AMPS/PCS Applications
3 mm square MLP Plastic Package
V 1.00
Features
n HMICTM Integrated Passive Circuit
n Low Insertion Loss, High Rejection Diplexer
n Suface Mountable in Microwave Circuits, No
Wirebonds Required
n Rugged HMICTM Construction with Polyamide
Encapsulation
n Reliable, Multilayer Metalization
n No External 50 Ω Matching Required
n Low Cost Miniature Plastic MLP Package
3mm MLP Plastic Package
Description
The MA4DP918-1277 HMICTM Integrated Passive Diplexer is
fabricated with the patented Heterolithic Microwave Integrated
Circuit (HMIC) process. HMIC circuits consist of multilayer
conductors on a glass dielectric, which acts as the low dispersion,
low loss microstrip transmission medium. The glass allows HMIC
devices to have excellent Q characteristics in a low profile, reliable
device. Conductors are printed with state-of-the-art semiconductor
photolithography processes and encapsulated in rugged silicon
nitride and BCB polyamide. The circuit is composed of plated
inductors and metal-insulator-metal (MIM) capacitors employing a
silicon nitride dielectric layer. The high performance 3 mm MLP
package allows for surface mount placement with no additional
circuit matching required.
Applications
The MA4DP918-1277 HMICTM Integrated Passive Diplexer is
recommended for use in wireless dual band GSM/DCS or
AMPS/PCS applications. The diplexer has low insertion loss in the
pass bands and high rejection in the stop bands. All ports are
matched to 50 ohms.
PIN Configuration
PIN Function
1 GND
2 NC
3 RF 900
4 NC
5 NC
6 NC
7 NC
8 NC
Paddle
PIN Function
9 NC
10 RF 1800
11 NC
12 GND
13 NC
14 ANT
15 NC
16 NC
GND
Absolute Maximum Ratings1
@ TA = +25 °C
(Unless otherwise specified)
Parameter
Value
Operating Temperature
-65 °C to +125 °C
Storage Temperature
-65 °C to +150 °C
RF C.W. Incident Power
3 Watts C.W.
Ordering Information
Part Number
MA4DP918-1277
Bulk
Package
MA4DP918-1277T
Tape and Reel
1. Exceeding any of these values may result in permanent
damage
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet MA4DP918-1277.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MA4DP918-1277 | HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package | Tyco Electronics |
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