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PDF CT0402S14AHSG Data sheet ( Hoja de datos )

Número de pieza CT0402S14AHSG
Descripción Metal Oxide Varistors SMD multilayer varistor
Fabricantes EPCOS 
Logotipo EPCOS Logotipo



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Metal Oxide Varistors
SMD multilayer varistor with Ni-barrier termination
CT0402S14AHSG
B72590T8140S160
Designation system
CT = Chip with three-layer- termination (Ag/Ni/Sn)
0402 = Dimensions of the device 04 x 02 (length x width in 1/100 inch)
S…A = Special tolerance of the varistor voltage
14 = Maximum operating voltage
HS = Designed for protection of high speed data lines
G = Taped version (cardboard tape, 7” reel, 10000 pieces/reel)
Figure
l
www.DataSheet4U.com
b
s
k
(all dimensions in mm)
l = 1.0 ± 0.15
b = 0.5 ± 0.10
s = 0.5 ± 0.10
k = 0.2 ± 0.10
As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for
applications, processes and circuits implemented within components or assemblies. The information describes the type of
component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved.
ISSUE DATE 28.01.2005
ISSUE
e PUBLISHER
KB VS PE
PAGE 1/7

1 page




CT0402S14AHSG pdf
Metal Oxide Varistors
SMD multilayer varistor with Ni-barrier termination
Recommended geometry of solder pad
B
A
CB
A
D
A = 0.6 mm
B = 0.6 mm
C = 0.5 mm
E = 1.7 mm
CT0402S14AHSG
B72590T8140S160
Recommended soldering temperature profile
Soldering zone
max. 7 s
at max. temp.
Preheating zone
max. 2 C/s
Cooling-down zone
max. 2 C/s
(natural air cooling)
300
C
T
245
40 s
215
180
100 s
100
20
0 50 100 150 200 s 250
t
VAR0543-W-E
This component should be soldered within 12 months after delivery from EPCOS. They
should be left in their original packings to avoid soldering problems due to oxidized terminals.
Storage temperature: -25 to 45 °C
Relative humidity: < 75% annual average, < 95% on maximum 30 days in a year.
The usage of mild non-activated fluxes for soldering is recommended, as well as proper
cleaning of the PCB.
The components are suited for Pb-free soldering.
ISSUE DATE 28.01.2005
ISSUE
e PUBLISHER
KB VS PE
PAGE 5/7

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