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PDF TGA4819-SL Data sheet ( Hoja de datos )
| Número de pieza | TGA4819-SL | |
| Descripción | Linear Optical Modulator Driver | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Advance Product Datasheet
April 6, 2006
10.7Gb/s Linear Optical Modulator Driver
TGA4819-SL
OC-192 Metro and Long Haul Applications
Surface Mount Package
Key Features and Performance
• Up to 10 VPP Linear Output Voltage
• 20 dB Gain
• Internal DC Blocks
• Single-ended Input / Output
• Small Form Factor
- 11.4 x 8.9 x 2 mm
- 0.450 x 0.350 x 0.080 inches
Description
The TriQuintwww.DataSheet4U.com TGA4819-SL is part of a series
of optical driver amplifiers suitable for a
variety of driver applications.
The TGA4819-SL is a medium power
wideband AGC amplifier that typically
provides 20dB small signal gain with 20dB
AGC range.
The TGA4819-SL is an excellent choice for
applications requiring high drive combined
with high linearity. The TGA4819-SL has
demonstrated capability to deliver 10Vpp
while maintaining output harmonic levels
near -30dBc for a 2GHz fundamental.
The TGA4819-SL requires a low frequency
choke and control circuitry.
Primary Applications
• Mach-Zehnder Linear Modulator Driver
for Metro and Long Haul
Preliminary Measured Performance
Bias Conditions: VD = 8V, VCTRL = +1V, ID = 310mA
PRBS 231-1; 10.7Gbps; Vin = 1Vpp; CPC = 50%
Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to
change without notice.
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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Advance Product Datasheet
April 6, 2006
TGA4819-SL
Measured Performance
VD = 8V; VCTRL = +1V; ID = 310mA; VG ≈ -0.3V
0.2 0.4 0.6 0.8 1.0 1.2 1.4
Vin (Vpp)
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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Advance Product Datasheet
April 6, 2006
TGA4819-SL
Assembly of a TGA4819-SL Package onto a Motherboard
Manual Assembly for Prototypes
1. Clean the motherboard with Acetone and rinse with alcohol and DI water. Allow the motherboard to fully dry.
2. Using a standard SN63 or lead-free solder paste, dispense solder paste dots of 5 to 15 mil in diameter to the
motherboard. Assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each
solder paste area and the closest edge of the ground pad.
3. Manually place a TGA4819-SL on the motherboard with correct orientation and good alignment. The
alignment can be determined manually by centering the package on the motherboard. The RF traces (pin 1 and
pin 10) are located along the center horizontal axis of the package.
4. Reflow the assembly on a hot plate with the surface temperature of the plate near 230 oC for 5 to 6 seconds
(for SnPb).
5. Let the assembly completely cool down. This package has little or no tendency to self- align during the reflow.
6. Clean the assembly with acetone and rinse with alcohol and DI water.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and
Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak
Temperature
Ramp-down Rate
SnPb
3 °C/sec
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
240 °C
10 – 20 sec
4 – 6 °C/sec
Pb Free
3 °C/sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
260 °C
10 – 20 sec
4 – 6 °C/sec
CAUTION: The TGA4819-SL contains GaAs MMIC devices that are susceptible to damage from
Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGA4819-SL.PDF ] | |
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